公开(公告)号：US10811765B2

公开(公告)日：2020-10-20

申请号：US16694299

申请日：2019-11-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeyoung Huh ,  Seunggil Jeon ,  Sunghoon Moon ,  Kyungwoo Lee ,  Sungchul Park

IPC: H01Q1/27 ,  H04M1/725 ,  H04B17/318 ,  H01Q1/52 ,  H01Q3/24 ,  H01Q1/24 ,  H04B1/3827

Abstract: An electronic device is provided. The electronic device includes a housing configured to mount at least a part of an external device operating 5th generation (5G) mobile communication, a support member connected to one region of the housing to support wearing of the electronic device with respect to one region of a user's body, a second antenna module disposed in a first region of the housing adjacent to a first antenna module among at least one antenna module included in the external device to face at least a part of the first antenna module, at least one third antenna module disposed in at least one of a second region of the housing or a third region of the support member, and at least one conductive member electrically connecting between the second antenna module and the at least one third antenna module.

公开(公告)号：US11388276B2

公开(公告)日：2022-07-12

申请号：US16839534

申请日：2020-04-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeyoung Huh ,  Kyungwan Park ,  Seunghoon Kang ,  Boram Kim ,  Youngjin Kim ,  Sunghoon Moon ,  Hongki Moon ,  Yoonsun Park ,  Hajoong Yun ,  Jonghoon Lim

IPC: H04M1/02 ,  H04N5/225 ,  H05K1/18 ,  H05K7/20

Abstract: An electronic device including: a housing including a frame structure that forms a portion of a surface of the electronic device, a plate structure that is surrounded by the frame structure and that includes a first opening, a metal portion containing a metallic material and a polymer portion containing a polymer material; a support plate that faces the plate structure and that includes a polymer area formed of a polymer material; a printed circuit board that makes contact with part of the metal portion of the housing; a camera module disposed between the polymer portion included in the plate structure and the polymer area included in the support plate, the camera module including a camera bracket, a camera PCB, and a light emitting unit and a light receiving unit; and a heat dissipating structure that transfers heat generated from the camera module to the metal portion included in the housing.

公开(公告)号：US11139565B2

公开(公告)日：2021-10-05

申请号：US16913110

申请日：2020-06-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seunggil Jeon ,  Namwoo Kim ,  Seongbeom Hong ,  Sunghoon Moon ,  Kyungwoo Lee

IPC: H01Q1/42 ,  H01Q1/24

Abstract: An electronic device is disclosed. An electronic device according to various embodiments includes: a housing having a front plate facing a first direction, a rear plate facing a second direction opposite the first direction, and a side housing surrounding a space between the front plate and the rear plate; a conductive member comprising a conductive material disposed between the front plate and the rear plate; a display viewable through the front plate; at least one antenna module including a plurality of antenna elements configured to form a beam in a third direction facing the conductive member, and disposed to be spaced apart from the conductive member in the space; and a wireless communication circuit electrically coupled to the antenna module and configured to transmit and/or receive at least one signal having a frequency in a range of 3 GHz to 100 GHz, wherein the conductive member has a first surface forming a first acute angle with a virtual line crossing centers of the antenna elements and facing in the third direction, and a second surface forming a second acute angle with the virtual line, wherein a joint of the first surface and the second surface is positioned on the virtual line.

公开(公告)号：USD820977S1

公开(公告)日：2018-06-19

申请号：US29596292

申请日：2017-03-07

Applicant: Samsung Electronics Co., Ltd.

Designer： Wanhyoung Lee ,  Sunghoon Moon ,  Jaehyun Baek ,  Jinha Seong ,  Geonho Yoon

公开(公告)号：US11264700B2

公开(公告)日：2022-03-01

申请号：US16723405

申请日：2019-12-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunggil Jeon ,  Jongsam Park ,  Seongbeom Hong ,  Sunghoon Moon ,  Kyungwoo Lee ,  Wonjoon Choi

IPC: H01Q1/22 ,  H01Q1/24 ,  H01Q9/40 ,  H04B1/40 ,  H01Q21/06 ,  H04M1/02 ,  H05K1/18

Abstract: An electronic device is provided that includes a housing; a printed circuit board including a first and second surfaces; an antenna module disposed on the first surface and adjacent to a side surface member, forming a first gap therewith, the antenna module being configured to radiate an antenna beam; a wireless communication circuit electrically connected with the antenna module, and configured to transmit or receive a signal having a frequency between 3 and 100 gigahertz; and a dielectric structure including a seating portion to have the antenna module mounted thereon, and configured to form the antenna beam to be radiated toward an outside of the housing.