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    Electronic device including heat dissipation structure
    1.
    发明授权
    Electronic device including heat dissipation structure 有权

    公开(公告)号：US12204384B2

    公开(公告)日：2025-01-21

    申请号：US17869109

    申请日：2022-07-20

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Joseph Ahn ,  Kyungha Koo ,  Hongki Moon

    IPC: G06F1/16 ,  G06F1/20 ,  H04M1/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/04 ,  H05K7/20

    Abstract: According to various embodiments of the disclosure, an electronic device may include: a housing, a display accommodated inside the housing, a support supporting the display and including a opening and a side wall surrounding the opening, and a heat dissipation structure at least a portion of which is positioned in the opening and bonded to the side wall, wherein the heat dissipation structure may include a heat dissipation layer having a first thermal conductivity and a protective layer having a second thermal conductivity, is the second thermal conductivity being lower than the first thermal conductivity, the protective layer covering at least a portion of the heat dissipation layer.

    Electronic device comprising heat-dissipating structure
    3.
    发明授权
    Electronic device comprising heat-dissipating structure 有权

    公开(公告)号：US11051435B2

    公开(公告)日：2021-06-29

    申请号：US16764607

    申请日：2018-11-22

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Inkuk Yun ,  Younho Choi ,  Hongki Moon ,  Hyoseok Na

    IPC: H05K7/20 ,  G06F1/20 ,  H01Q1/02

    Abstract: An electronic device according to various embodiments of the disclosure may include a housing including a front plate and a rear plate facing the front plate, a display exposed through at least part of the front plate, an intermediate plate interposed between the display and the rear plate, and including a first face facing the display and a second face facing the rear plate, a first printed circuit board interposed between the display and the intermediate plate, a first electronic component attached to a first portion of the second face, a second electronic component attached to a second portion, away from the first portion, of the second face, and a first heat-dissipating structure extended between the first portion and the second portion along the second face.

    ELECTRONIC DEVICE HAVING THERMAL DIFFUSION STRUCTURE
    5.
    发明申请
    ELECTRONIC DEVICE HAVING THERMAL DIFFUSION STRUCTURE 有权

    公开(公告)号：US20220083110A1

    公开(公告)日：2022-03-17

    申请号：US17532518

    申请日：2021-11-22

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Ohhyuck Kwon ,  Jaeyoung Huh ,  Daesuk Kang ,  Seunghoon Kang ,  Boram Kim ,  Hongki Moon ,  Yoonsun Park ,  Kyungwoo Lee ,  Seungjoo Lee ,  Jonghoon Lim

    IPC: G06F1/20 ,  H01L23/427 ,  G06F1/16

    Abstract: Disclosed is an electronic device having a thermal diffusion structure and including a housing comprising a first surface, a second surface facing the first surface, and a third surface vertical to the first surface and the second surface, a display exposed through at least part of the first surface, a battery arranged between the first surface and the second surface, a heating source arranged between the battery and the third surface in a direction vertical to the first surface and the second surface, and a first thermal diffusion member arranged vertically to the first surface and the second surface, the first thermal diffusion member including a first portion in thermal contact with at least part of the heating source and diffusing heat provided by the heating source to at least one second portion.

    ELECTRONIC DEVICE COMPRISING THERMAL DIFFUSION MEMBER
    8.
    发明公开
    ELECTRONIC DEVICE COMPRISING THERMAL DIFFUSION MEMBER 审中-公开

    公开(公告)号：US20240008232A1

    公开(公告)日：2024-01-04

    申请号：US18370143

    申请日：2023-09-19

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hajoong YUN ,  Yoonsun Park ,  Seunghoon Kang ,  Kyungha Koo ,  Hongki Moon ,  Jongkil Park ,  Yongjae Song

    IPC: H05K7/20 ,  H05K5/02 ,  H04M1/02

    CPC classification number: H05K7/20972 ,  H05K5/0217 ,  H04M1/0268

    Abstract: An electronic device includes a first housing; a second housing slidable into and out of the first housing; a sliding plate configured to be at least partially slid within the second housing; a flexible display including a display area that is variable as the second housing slides into and out of the first housing; a printed circuit board in an inner space of the first housing; a first shaft; and a thermal diffusion member including a first end, disposed on the at least one electronic component and partially wound, and a second end coupled to the first shaft, and the thermal diffusion member is configured such that at least a portion of the thermal diffusion member spreads out in an inner space of the second housing as a sliding-out operation is performed by the second housing with respect to the first housing.

    Heat transfer member and electronic device including the same
    9.
    发明授权
    Heat transfer member and electronic device including the same 有权

    公开(公告)号：US11202363B2

    公开(公告)日：2021-12-14

    申请号：US16795223

    申请日：2020-02-19

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hongki Moon ,  Yoonsun Park ,  Seunghoon Kang ,  Kyungha Koo ,  Hajoong Yun ,  Seungjoo Lee ,  Yeonjoo Lee ,  Seyoung Jang

    IPC: H05K1/02 ,  H02J50/27

    Abstract: An electronic device for improving heat transfer is provided. The electronic device includes a housing, a display mounted on at least one surface of the housing, a battery, a supporting member disposed adjacent to a back surface of the display and supporting the display, a printed circuit board on which electronic components are mounted, a shield can surrounding at least a portion of the electronic components, a shielding structure disposed on an outer surface of the shield can to shield the electronic components, and a first heat transfer member disposed on an outer surface of the shielding structure and including a partial area that faces at least one electronic component among the plurality of electronic components mounted on the printed circuit board and another partial area that is bent and faces another electronic component among the plurality of electronic components mounted on the printed circuit board.

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