Invention Grant
- Patent Title: Resin composition and article made therefrom
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Application No.: US16923315Application Date: 2020-07-08
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Publication No.: US11407895B2Publication Date: 2022-08-09
- Inventor: Ching-Hsien Hsu
- Applicant: Elite Material Co., Ltd.
- Applicant Address: TW Taoyuan
- Assignee: Elite Material Co., Ltd.
- Current Assignee: Elite Material Co., Ltd.
- Current Assignee Address: TW Taoyuan
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW109118008 20200529
- Main IPC: B32B27/26
- IPC: B32B27/26 ; B32B27/28 ; B32B27/38 ; C08G59/24 ; C08G59/50 ; C08L79/08 ; C08L63/00 ; C08J5/24
Abstract:
A resin composition includes 60 parts by weight of a maleimide resin; 10 parts by weight to 30 parts by weight of an epoxy resin of Formula (I), wherein n represents an integer of 0 to 10: and 2 parts by weight to 40 parts by weight of a methylenebis (diethylaniline). Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.
Public/Granted literature
- US20210371655A1 RESIN COMPOSITION AND ARTICLE MADE THEREFROM Public/Granted day:2021-12-02
Information query
