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公开(公告)号：US20250059372A1
公开(公告)日：2025-02-20
申请号：US18368712
申请日：2023-09-15
Applicant: Elite Material Co., Ltd.
Inventor： Chen-Yu HSIEH
Abstract: A resin composition includes a vinyl group-containing resin and a phosphorus-containing compound of Formula (1) or a prepolymer thereof, wherein: relative to 100 parts by weight of the vinyl group-containing resin, the phosphorus-containing compound of Formula (1) is 35 to 60 parts by weight; or relative to 100 parts by weight of the vinyl group-containing resin, the prepolymer of the phosphorus-containing compound of Formula (1) is 50 to 90 parts by weight. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and one or more properties can be improved.
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公开(公告)号：US20240010791A1
公开(公告)日：2024-01-11
申请号：US17881299
申请日：2022-08-04
Applicant: Elite Material Co., Ltd.
Inventor： Shu-Hao CHANG
IPC: C08G65/48 , C08G73/10 , C08K5/159 , C08K5/057 , C08K5/544 , C08K3/36 , C08K3/38 , C08J5/24 , C08J5/18
CPC classification number: C08G65/485 , C08G73/10 , C08K5/159 , C08K5/057 , C08K5/544 , C08K3/36 , C08K3/38 , C08J5/24 , C08J5/18 , C08G2650/04 , C08K2003/385
Abstract: A resin composition includes 120 parts by weight of a vinyl group-containing polyphenylene ether resin, 5 parts by weight to 10 parts by weight of a compound of Formula (1), 15 parts by weight to 25 parts by weight of a compound of Formula (2), and 70 parts by weight to 110 parts by weight of an inorganic filler. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including difference rate of dissipation factor, gel time stability and stickiness.
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公开(公告)号：US20230391806A1
公开(公告)日：2023-12-07
申请号：US18322323
申请日：2023-05-23
Applicant: Elite Material Co., Ltd.
Inventor： Chien-Hsiang CHEN , Chun-Hsiung CHANG
IPC: C07F9/12
CPC classification number: C07F9/12
Abstract: A phosphorus-containing compound of Formula (1) and a preparation method thereof are provided. The phosphorus-containing compound is a compound having a reactive functional group and containing a phosphorus atom in its structure. The preparation method includes: (1) reacting magnolol and phosphoryl chloride in a first alkaline environment to obtain an intermediate product; and (2) reacting the intermediate product and a benzenediol in a second alkaline environment to obtain the phosphorus-containing compound.
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公开(公告)号：US11572469B2
公开(公告)日：2023-02-07
申请号：US17339566
申请日：2021-06-04
Applicant: Elite Material Co., Ltd.
Inventor： Ching-Hsien Hsu , Tse-Hung Liu , Tsan-Hung Tsai
IPC: C08K5/3492 , C08L71/12
Abstract: A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin; 2 parts by weight to 50 parts by weight of any compound having a structure of Formula (1) or a combination thereof; and 20 parts by weight to 80 parts by weight of a polyolefin resin; the polyolefin resin includes styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, styrene-butadiene copolymer, hydrogenated styrene-butadiene copolymer, polybutadiene, maleic anhydride-butadiene copolymer or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.
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公开(公告)号：US20210371656A1
公开(公告)日：2021-12-02
申请号：US16923340
申请日：2020-07-08
Applicant: Elite Material Co., Ltd.
Inventor： Yi-Fei YU , Chien-Hung LEE , Chen-Yu HSIEH
Abstract: A resin composition includes a first prepolymer and a second prepolymer, the first prepolymer being prepared from a first mixture subjected to a prepolymerization reaction, the second prepolymer being prepared from a second mixture subjected to a prepolymerization reaction, wherein the first mixture includes a maleimide resin and a benzoxazine resin, and the second mixture includes a maleimide resin and a bis(trifluoromethyl)benzidine. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including copper foil peeling strength, dissipation factor, ratio of thermal expansion, cure shrinkage and glass transition temperature.
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Patent Agency Ranking
公开(公告)号：US10557033B2
公开(公告)日：2020-02-11
申请号：US15373915
申请日：2016-12-09
Applicant: Elite Material Co., Ltd.
Inventor： Shu-Hao Chang
Abstract: The disclosure relates to a resin composition, comprising an epoxy resin, a high molecular weight polyetheramine and an amine-terminated acrylonitrile rubber. Various products can be made from the resin composition, such as prepregs, laminates, printed circuit boards or rigid-flex boards, in which one, multiple or all of the following properties can be met: low resin flow, low dust weight loss, high peel strength at room temperature and at high temperature, low moisture absorption rate, and better varnish stability.
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公开(公告)号：US10000599B2
公开(公告)日：2018-06-19
申请号：US15373834
申请日：2016-12-09
Applicant: Elite Material Co., Ltd.
Inventor： Chen Yu Hsieh
IPC: C08K7/18 , C08F230/02
Abstract: The disclosure relates to a phosphorus-containing vinyl polyphenylene ether obtained by reacting a phosphorus-containing vinyl compound with a vinyl polyphenylene ether, a resin composition including the phosphorus-containing vinyl polyphenylene ether and a product thereof. Various products can be made from the resin composition, such as resin films, prepregs, resin-coated coppers, laminates or printed circuit boards, and they have one, multiple or all of the following properties: lower coefficient of thermal expansion, lower thermal expansion, higher thermal resistance, better flame retardancy, lower dielectric constant, lower dielectric loss and so forth.
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公开(公告)号：US09955569B2
公开(公告)日：2018-04-24
申请号：US15363556
申请日：2016-11-29
Applicant: ELITE MATERIAL CO., LTD.
Inventor： Ya-Wen Kuo , Li-Chih Yu , Ching-Hsin Ho
CPC classification number: H05K1/0271 , H05K1/0366 , H05K1/09 , H05K3/4602 , H05K3/4652 , H05K2201/029 , H05K2201/0355 , H05K2201/068
Abstract: A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers.
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9.发明授权公开(公告)号：US09926435B2
公开(公告)日：2018-03-27
申请号：US15067144
申请日：2016-03-10
Applicant: Elite Material Co., Ltd.
Inventor： Chen-Yu Hsieh
CPC classification number: C08K5/53 , C08J5/18 , C08J5/24 , C08J2371/00 , C08J2371/12 , H05K1/0326 , H05K1/0353 , H05K1/0373 , H05K1/09 , H05K2201/012 , H05K2203/122 , C08L71/02
Abstract: A resin composition, a copper-clad laminate using the same, and a printed circuit board using the same are introduced. The resin composition comprises a specific phosphorus-containing salt and a prepolymer of vinyl-containing polyphenylene ether. The resin composition features specific ingredients and proportion to thereby achieve satisfactory properties of prepreg made from the resin composition, and attain satisfactory laminate properties, such as high degree of heat resistance and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper-clad laminates and printed circuit boards.
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10.发明授权Low dielectric halogen-free resin composition and circuit board using the same 有权低介电无卤树脂组合物和使用其的电路板公开(公告)号：US09428646B2
公开(公告)日：2016-08-30
申请号：US13948399
申请日：2013-07-23
Applicant: ELITE MATERIAL CO., LTD.
Inventor： Chen-Yu Hsieh
CPC classification number: C08L71/02 , C08K5/5399 , C08L21/00 , C08L71/12 , C08L79/08 , H05K1/0353 , H05K2201/012 , H05K2201/0209 , Y10T428/24917 , Y10T428/31681
Abstract: A halogen-free resin composition includes (A) 100 parts by weight of polyphenylene oxide resin; (B) 10 to 50 parts by weight of maleimide resin; (C) 5 to 100 parts by weight of polybutadiene copolymer; (D) 5 to 30 parts by weight of cyanate ester resin; and (E) 15 to 150 parts by weight of phosphazene. The halogen-free resin composition is characterized by specific ingredients and proportions thereof to achieve circuit board laminate properties, such as a high glass transition temperature, low coefficient of thermal expansion, low dielectric properties, heat resistance, flame retardation, and being halogen-free, and thus is applicable to the manufacturing of a prepreg or resin film, thereby being applicable to the manufacturing of metal laminates and printed circuit boards.
Abstract translation: 无卤素树脂组合物包含（A）100重量份聚苯醚树脂; （B）10〜50重量份马来酰亚胺树脂; （C）5〜100重量份的聚丁二烯共聚物; （D）5〜30重量份的氰酸酯树脂; 和（E）15〜150重量份的磷腈。 无卤素树脂组合物的特征在于其特定成分和比例，以实现电路板层压性能，例如高玻璃化转变温度，低热膨胀系数，低介电性能，耐热性，阻燃性和无卤素 ，因此可以应用于预浸料或树脂膜的制造，从而适用于金属层叠体和印刷电路板的制造。
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