Invention Grant
- Patent Title: Device for self-assembling semiconductor light-emitting diodes
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Application No.: US16842347Application Date: 2020-04-07
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Publication No.: US11410864B2Publication Date: 2022-08-09
- Inventor: Inbum Yang , Junghun Rho , Imdeok Jung , Bongwoon Choi
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2019-0115574 20190919,KR10-2019-0120060 20190927
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/683 ; H01L25/075 ; H01L33/32
Abstract:
Discussed is a device for self-assembling semiconductor light-emitting diodes includes a substrate chuck that is provided in an assembly chamber and supports a substrate and disposes the substrate at an assembly position, wherein the substrate chuck sucks or injects a gas present between the substrate and a fluid during loading and unloading of the substrate.
Public/Granted literature
- US20210090916A1 DEVICE FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT-EMITTING DIODES Public/Granted day:2021-03-25
Information query
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