Invention Grant
- Patent Title: LED module
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Application No.: US16636881Application Date: 2018-08-10
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Publication No.: US11417583B2Publication Date: 2022-08-16
- Inventor: Thomas Feichtinger , Franz Rinner , Werner Rollett
- Applicant: TDK Electronics AG
- Applicant Address: DE Munich
- Assignee: TDK Electronics AG
- Current Assignee: TDK Electronics AG
- Current Assignee Address: DE Munich
- Agency: Slater Matsil, LLP
- Priority: DE102017118490.2 20170814
- International Application: PCT/EP2018/071787 WO 20180810
- International Announcement: WO2019/034562 WO 20190221
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L23/34 ; H01L23/60 ; H01L25/075 ; H01L25/16 ; H01L33/64 ; H05K1/02 ; H05K1/03 ; H05K1/18 ; H01L23/15 ; H01L23/498
Abstract:
An LED module is disclosed. In an embodiment an LED module includes a thermally conductive substrate made of a multilayer ceramic, at least one LED on the substrate, passive SMD components arranged on the substrate, a passive component integrated in the substrate and a heat spreader configured to dissipate waste heat in horizontal and vertical directions.
Public/Granted literature
- US20200294981A1 LED Module Public/Granted day:2020-09-17
Information query
IPC分类:
