公开(公告)号：US11417583B2

公开(公告)日：2022-08-16

申请号：US16636881

申请日：2018-08-10

Applicant: TDK Electronics AG

Inventor： Thomas Feichtinger ,  Franz Rinner ,  Werner Rollett

IPC: H01L23/373 ,  H01L23/34 ,  H01L23/60 ,  H01L25/075 ,  H01L25/16 ,  H01L33/64 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H01L23/15 ,  H01L23/498

Abstract: An LED module is disclosed. In an embodiment an LED module includes a thermally conductive substrate made of a multilayer ceramic, at least one LED on the substrate, passive SMD components arranged on the substrate, a passive component integrated in the substrate and a heat spreader configured to dissipate waste heat in horizontal and vertical directions.

公开(公告)号：US20200294981A1

公开(公告)日：2020-09-17

申请号：US16636881

申请日：2018-08-10

Applicant: TDK Electronics AG

Inventor： Thomas Feichtinger ,  Franz Rinner ,  Werner Rollett

IPC: H01L25/16 ,  H05K1/02 ,  H01L23/34 ,  H01L23/60 ,  H01L25/075 ,  H01L33/64 ,  H05K1/03 ,  H05K1/18

Abstract: An LED module is disclosed. In an embodiment an LED module includes a thermally conductive substrate made of a multilayer ceramic, at least one LED on the substrate, passive SMD components arranged on the substrate, a passive component integrated in the substrate and a heat spreader configured to dissipate waste heat in horizontal and vertical directions.