Invention Grant
- Patent Title: System and method for extended peripheral component interconnect express fabrics
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Application No.: US17153639Application Date: 2021-01-20
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Publication No.: US11429550B2Publication Date: 2022-08-30
- Inventor: Wesley Shao
- Applicant: Futurewei Technologies, Inc.
- Applicant Address: US TX Plano
- Assignee: Futurewei Technologies, Inc.
- Current Assignee: Futurewei Technologies, Inc.
- Current Assignee Address: US TX Plano
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F13/42 ; G06F13/16

Abstract:
An extended peripheral component interconnect express (PCIe) device includes a host PCIe fabric comprising a host root complex. The host PCIe fabric has a first set of bus numbers and a first memory mapped input/output (MMIO) space on a host CPU. An extended PCIe fabric includes a root complex endpoint (RCEP) as part of an endpoint of the host PCIe fabric. The extended PCIe fabric has a second set of bus numbers and a second MMIO space separate from the first set of bus numbers and the first MMIO space, respectively.
Public/Granted literature
- US20210216485A1 System and Method for Extended Peripheral Component Interconnect Express Fabrics Public/Granted day:2021-07-15
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