Invention Grant
- Patent Title: Mmwave waveguides featuring power-over-waveguide technology for automotive applications
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Application No.: US16764600Application Date: 2017-12-30
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Publication No.: US11437693B2Publication Date: 2022-09-06
- Inventor: Georgios C. Dogiamis , Sasha N. Oster , Telesphor Kamgaing , Kenneth Shoemaker , Erich N. Ewy , Adel A. Elsherbini , Johanna M. Swan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2017/069156 WO 20171230
- International Announcement: WO2019/133018 WO 20190704
- Main IPC: H01P3/16
- IPC: H01P3/16 ; H04B3/54

Abstract:
Embodiments include a waveguide bundle, a dielectric waveguide, and a vehicle. The waveguide bundle includes dielectric waveguides, where each dielectric waveguide has a dielectric core and a conductive coating around the dielectric core. The waveguide bundle also has a power delivery layer formed around the dielectric waveguides, and an insulating jacket enclosing the waveguide bundle. The waveguide bundle may also include the power deliver layer as a braided shield, where the braided shield provides at least one of a DC and an AC power line. The waveguide bundle may further have one of the dielectric waveguides provide a DC ground over their conductive coatings, where the AC power line does not use the braided shield as reference or ground. The waveguide bundle may include that the power delivery layer is separated from the dielectric waveguides by a braided shield, where the power delivery layer is a power delivery braided foil.
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