Invention Grant
- Patent Title: Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor device
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Application No.: US16398164Application Date: 2019-04-29
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Publication No.: US11446851B2Publication Date: 2022-09-20
- Inventor: Sheng-Feng Weng , Ching-Hua Hsieh , Chung-Shi Liu , Chih-Wei Lin , Sheng-Hsiang Chiu , Yao-Tong Lai , Chia-Min Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: B29C45/03
- IPC: B29C45/03 ; B29C45/14 ; H01L21/56 ; B29C45/00
Abstract:
A molding apparatus is configured for molding a semiconductor device and includes a lower mold and an upper mold. The lower mold is configured to carry the semiconductor device. The upper mold is disposed above the lower mold for receiving the semiconductor device and includes a mold part and a dynamic part. The mold part is configured to cover the upper surface of the semiconductor device. The dynamic part is disposed around a device receiving region of the upper mold and configured to move relatively to the mold part. A molding method and a molded semiconductor device are also provided.
Public/Granted literature
- US20200338796A1 MOLDING APPARATUS, MANUFACTURING METHOD OF MOLDED SEMICONDUCTOR DEVICE AND MOLDED SEMICONDUCTOR DEVICE Public/Granted day:2020-10-29
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