Invention Grant
- Patent Title: Method of manufacturing microneedle array
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Application No.: US16391338Application Date: 2019-04-23
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Publication No.: US11452854B2Publication Date: 2022-09-27
- Inventor: Yoshiki Sakazaki , Ikuo Takano , Satoshi Wakamatsu , Keio Okano , Kenichiro Tamaki
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JPJP2018-094789 20180516
- Main IPC: A61M37/00
- IPC: A61M37/00 ; B29C39/10 ; B29C39/42 ; B29C39/44 ; B29K105/00 ; B29L31/00

Abstract:
Provided is a method of manufacturing a microneedle array in which an active ingredient is concentrated at a tip while an active ingredient content is guaranteed. In order to achieve the object, a method of manufacturing a microneedle array in which needle-like recessed portions of a mold are filled with a liquid to form one dose of a patch includes determining a filling amount of the liquid from a difference in mass of the mold before and after filling of the liquid, determining a filling state of the liquid in the mold filled with the liquid, sucking the mold in which the filling amount and the filling state of the liquid are determined to be normal from a rear face, and evaporating and drying a solvent of the liquid of the sucked mold.
Public/Granted literature
- US20190351204A1 METHOD OF MANUFACTURING MICRONEEDLE ARRAY Public/Granted day:2019-11-21
Information query
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