- Patent Title: Metal mask substrate for vapor deposition, metal mask for vapor deposition, production method for metal mask substrate for vapor deposition, and production method for metal mask for vapor deposition
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Application No.: US17013535Application Date: 2020-09-04
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Publication No.: US11453940B2Publication Date: 2022-09-27
- Inventor: Sumika Tamura , Mikio Shinno , Daisei Fujito , Kiyoaki Nishitsuji , Takehiro Nishi , Naoko Mikami
- Applicant: TOPPAN PRINTING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Squire Patton Boggs (US) LLP
- Priority: JP2015-143509 20150717,JP2015-171440 20150831,JP2016-079099 20160411
- Main IPC: C23C14/04
- IPC: C23C14/04 ; C25D1/04 ; C25B11/055 ; C25C1/08 ; C25C7/08 ; C25D1/10 ; C25D11/34 ; H01L51/00 ; C25D3/56

Abstract:
A vapor deposition metal mask substrate includes a nickel-containing metal sheet including a obverse surface and a reverse surface, which is opposite to the obverse surface. At least one of the obverse surface and the reverse surface is a target surface for placing a resist layer. The target surface has a surface roughness Sa of less than or equal to 0.019 μm. The target surface has a surface roughness Sz of less than or equal to 0.308 μm.
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