公开(公告)号：US11453940B2

公开(公告)日：2022-09-27

申请号：US17013535

申请日：2020-09-04

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Sumika Tamura ,  Mikio Shinno ,  Daisei Fujito ,  Kiyoaki Nishitsuji ,  Takehiro Nishi ,  Naoko Mikami

IPC: C23C14/04 ,  C25D1/04 ,  C25B11/055 ,  C25C1/08 ,  C25C7/08 ,  C25D1/10 ,  C25D11/34 ,  H01L51/00 ,  C25D3/56

Abstract: A vapor deposition metal mask substrate includes a nickel-containing metal sheet including a obverse surface and a reverse surface, which is opposite to the obverse surface. At least one of the obverse surface and the reverse surface is a target surface for placing a resist layer. The target surface has a surface roughness Sa of less than or equal to 0.019 μm. The target surface has a surface roughness Sz of less than or equal to 0.308 μm.

公开(公告)号：US10273569B2

公开(公告)日：2019-04-30

申请号：US15786463

申请日：2017-10-17

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Sumika Tamura ,  Naoko Mikami ,  Daisei Fujito ,  Kiyoaki Nishitsuji ,  Takehiro Nishi

IPC: H01L51/00 ,  H01L51/50 ,  H01L51/52 ,  C23C14/02 ,  C23C14/04 ,  C23C14/08 ,  C23C14/12 ,  C23C14/22 ,  C23F1/02 ,  C23F1/44 ,  G01N21/55 ,  G03F7/00 ,  C23F1/14

Abstract: A metal mask substrate includes a metal surface to which a resist is to be disposed. A specular reflectance of incident light to the surface is 45.2% or more.

公开(公告)号：US10903426B2

公开(公告)日：2021-01-26

申请号：US15869597

申请日：2018-01-12

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Daisei Fujito ,  Kiyoaki Nishitsuji ,  Takehiro Nishi

IPC: H01L51/00 ,  B05C21/00 ,  C23F1/16 ,  H01L51/56 ,  H05B33/10 ,  C23F1/02 ,  C23C14/04

Abstract: A metal mask substrate includes a metal obverse surface configured such that a resist is placed on the obverse surface. The obverse surface has a three-dimensional surface roughness Sa of less than or equal to 0.11 μm. The obverse surface also has a three-dimensional surface roughness Sz of less than or equal to 3.17 μm.

公开(公告)号：US11111585B2

公开(公告)日：2021-09-07

申请号：US15786446

申请日：2017-10-17

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Naoko Mikami ,  Sumika Tamura ,  Reiji Terada ,  Masashi Kurata ,  Daisei Fujito ,  Kiyoaki Nishitsuji ,  Takehiro Nishi

IPC: C23F1/28 ,  C23C14/24 ,  C23C14/34 ,  C23F1/16 ,  B21B1/22 ,  B21B3/02 ,  B32B15/01 ,  B32B15/04 ,  C23C14/04 ,  C23C16/04 ,  C23F1/40 ,  H01L51/00

Abstract: A rolled metal sheet includes an obverse surface and a reverse surface that is a surface located opposite to the obverse surface. At least either one of the obverse surface and the reverse surface is a processing object. A method for manufacturing a metal mask substrate includes reducing a thickness of the rolled metal sheet to 10 μm or less by etching the processing object by 3 μm or more by use of an acidic etching liquid, and roughening the processing object so that the processing object becomes a resist formation surface that has a surface roughness Rz of 0.2 μm or more, thereby obtaining a metal mask sheet.

公开(公告)号：US11746423B2

公开(公告)日：2023-09-05

申请号：US17390579

申请日：2021-07-30

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Naoko Mikami ,  Sumika Tamura ,  Reiji Terada ,  Masashi Kurata ,  Daisei Fujito ,  Kiyoaki Nishitsuji ,  Takehiro Nishi

IPC: C23F1/28 ,  C23C14/24 ,  C23C14/34 ,  C23F1/16 ,  H10K71/20 ,  C23F1/02 ,  C23F1/04 ,  B21B1/22 ,  B21B3/02 ,  B32B15/01 ,  B32B15/04 ,  C23C14/04 ,  C23C16/04 ,  C23F1/40

CPC classification number: C23F1/28 ,  B21B1/227 ,  B21B3/02 ,  B32B15/015 ,  B32B15/04 ,  C23C14/042 ,  C23C14/24 ,  C23C14/34 ,  C23C16/042 ,  C23F1/02 ,  C23F1/04 ,  C23F1/16 ,  C23F1/40 ,  H10K71/211 ,  B21B2261/04

Abstract: A rolled metal sheet includes an obverse surface and a reverse surface that is a surface located opposite to the obverse surface. At least either one of the obverse surface and the reverse surface is a processing object. A method for manufacturing a metal mask substrate includes reducing a thickness of the rolled metal sheet to 10 μm or less by etching the processing object by 3 μm or more by use of an acidic etching liquid, and roughening the processing object so that the processing object becomes a resist formation surface that has a surface roughness Rz of 0.2 μm or more, thereby obtaining a metal mask sheet.

公开(公告)号：US11706968B2

公开(公告)日：2023-07-18

申请号：US17100769

申请日：2020-11-20

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Daisei Fujito ,  Kiyoaki Nishitsuji ,  Takehiro Nishi

IPC: H01L51/00 ,  C23F1/02 ,  C23C14/04 ,  H05B33/10 ,  B05C21/00 ,  C23F1/16 ,  H10K71/16 ,  H10K71/00

CPC classification number: H10K71/166 ,  B05C21/005 ,  C23C14/042 ,  C23F1/02 ,  C23F1/16 ,  H05B33/10 ,  H10K71/00

Abstract: A metal mask substrate includes a metal obverse surface configured such that a resist is placed on the obverse surface. The obverse surface has a three-dimensional surface roughness Sa of less than or equal to 0.11 μm. The obverse surface also has a three-dimensional surface roughness Sz of less than or equal to 3.17 μm.