Invention Grant
- Patent Title: Discharging method and substrate processing apparatus
-
Application No.: US16854067Application Date: 2020-04-21
-
Publication No.: US11462431B2Publication Date: 2022-10-04
- Inventor: Toshiyuki Arakane , Tetsu Tsunamoto , Yoshinori Osaki , Masanori Sato
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JPJP2019-086407 20190426
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67 ; H01L21/3065 ; H01L21/687 ; H01J37/32 ; C23C16/458

Abstract:
A discharging method of removing electric charge from a substrate is provided. In the discharging method, gas is supplied into a processing chamber while the substrate is placed on an electrostatic chuck provided in the processing chamber, and direct-current (DC) voltage is applied to an attracting electrode of the electrostatic chuck, until discharge occurs in the processing chamber. After the discharge occurs, the DC voltage is adjusted to a magnitude in which an amount of charge on the substrate becomes zero or becomes in a neighborhood of zero, and the substrate is removed from the electrostatic chuck.
Public/Granted literature
- US20200343124A1 DISCHARGING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2020-10-29
Information query
IPC分类: