Invention Grant
- Patent Title: Patterning method
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Application No.: US17237699Application Date: 2021-04-22
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Publication No.: US11476155B2Publication Date: 2022-10-18
- Inventor: Victor M. Blanco , Frederic Lazzarino
- Applicant: IMEC VZW
- Applicant Address: BE Leuven
- Assignee: IMEC VZW
- Current Assignee: IMEC VZW
- Current Assignee Address: BE Leuven
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Priority: EP20171065 20200423
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/033

Abstract:
A method that provides patterning of an underlying layer to form a first set of trenches and a second set of trenches in the underlying layer is based on a combination of two litho-etch (LE) patterning processes supplemented with a spacer-assisted (SA) technique. The method uses one or more first upper blocks formed by a tone-inversion approach, an upper memorization layer allowing first memorizing upper trenches, and then second upper blocks, and a lower memorization layer allowing first memorizing first lower trenches and one or more first lower blocks, and then second lower trenches and one or more second lower blocks.
Public/Granted literature
- US20210335664A1 PATTERNING METHOD Public/Granted day:2021-10-28
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