Invention Grant
- Patent Title: Radio-frequency module and communication device
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Application No.: US16727141Application Date: 2019-12-26
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Publication No.: US11476226B2Publication Date: 2022-10-18
- Inventor: Takanori Uejima , Yuji Takematsu , Naoya Matsumoto , Shou Matsumoto , Tetsuro Harada , Dai Nakagawa , Yutaka Sasaki , Yuuki Fukuda
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JPJP2018-247192 20181228
- Main IPC: H03F1/56
- IPC: H03F1/56 ; H04B1/40 ; H01L23/00 ; H01L23/66 ; H03F3/24 ; H03F3/68 ; H01L23/31 ; H01L23/552 ; H01L25/18 ; H01L23/538

Abstract:
A radio-frequency module includes: a transmitting circuit disposed on a mounting substrate to process a radio-frequency signal input from a transmission terminal and to output a resultant signal to a common terminal; a receiving circuit disposed on the mounting substrate to process a radio-frequency signal input from the common terminal and to output a resultant signal to a reception terminal; a first inductor included in a first transmitting circuit; and a bonding wire connected to the ground and bridging over the first inductor.
Public/Granted literature
- US20200211998A1 RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE Public/Granted day:2020-07-02
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