公开(公告)号：US12096552B2

公开(公告)日：2024-09-17

申请号：US17216722

申请日：2021-03-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuji Takematsu ,  Takanori Uejima ,  Sho Matsumoto ,  Tetsuro Harada ,  Dai Nakagawa ,  Naoya Matsumoto ,  Yutaka Sasaki ,  Yuuki Fukuda

IPC: H05K1/02 ,  H03F3/195 ,  H03F3/24 ,  H04B1/44

CPC classification number: H05K1/0243 ,  H03F3/195 ,  H03F3/245 ,  H04B1/44 ,  H03F2200/294 ,  H03F2200/318 ,  H03F2200/451 ,  H05K2201/1006 ,  H05K2201/10098

Abstract: A radio frequency module includes: a first mounting board having a first principal surface and a second principal surface; a second mounting board having a third principal surface facing the second principal surface and a fourth principal surface; a transmission filter having a first mounting surface facing the second principal surface and a first top surface; and a reception filter having a second mounting surface facing the third principal surface and a second top surface; wherein the transmission and reception filters overlap at least partially in a plan view of the first and second mounting boards, an output terminal of the transmission filter is arranged on the first top surface, an input terminal of the reception filter is arranged on the second top surface, and the output and input terminals are connected by a conductive member not routed through the first mounting board or the second mounting board.

公开(公告)号：US11309925B2

公开(公告)日：2022-04-19

申请号：US17224154

申请日：2021-04-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Sho Matsumoto ,  Takanori Uejima ,  Yuji Takematsu ,  Tetsuro Harada ,  Dai Nakagawa ,  Naoya Matsumoto ,  Yutaka Sasaki ,  Yuuki Fukuda

IPC: H04B1/04 ,  H04B1/44

Abstract: A radio-frequency module includes a mounting substrate having a first main surface and a second main surface on opposite sides of the mounting substrate; an external connection terminal arranged on the first main surface; and a first transmission power amplifier arranged on the first main surface. The first transmission power amplifier includes an amplifier first main surface closest to the first main surface, an amplifier second main surface that faces away from the amplifier first main surface, a first input-output electrode arranged on the amplifier first main surface and through which a radio-frequency signal input into the first transmission power amplifier or a radio-frequency signal output from the first transmission power amplifier is transmitted, and a first ground electrode arranged on the amplifier second main surface.

公开(公告)号：US10971466B2

公开(公告)日：2021-04-06

申请号：US16533982

申请日：2019-08-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Katsunari Nakazawa ,  Takanori Uejima ,  Motoji Tsuda ,  Yuji Takematsu ,  Dai Nakagawa ,  Tetsuro Harada ,  Masahide Takebe ,  Naoya Matsumoto ,  Yoshiaki Sukemori ,  Mitsunori Samata ,  Yutaka Sasaki ,  Yuuki Fukuda

IPC: H03F3/21 ,  H03F1/30 ,  H01L23/00 ,  H01L25/16 ,  H01L23/66 ,  H01L23/367 ,  H01L23/538 ,  H04B1/40

Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to the transmission power amplifier, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view of the mounting board, a board main part placed outside the via conductor, and an insulating part placed inside the via conductor, and the bump electrode and the via conductor are connected while at least partially overlapping each other in the foregoing plan view, and the board main part and the insulating part are each composed of an insulating material of the same kind.

公开(公告)号：US11631659B2

公开(公告)日：2023-04-18

申请号：US16780087

申请日：2020-02-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Motoji Tsuda ,  Takanori Uejima ,  Yuji Takematsu ,  Katsunari Nakazawa ,  Masahide Takebe ,  Shou Matsumoto ,  Naoya Matsumoto ,  Yutaka Sasaki ,  Yuuki Fukuda

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/552 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/24 ,  H01Q1/02

Abstract: A high-frequency module includes a mounting substrate having main surfaces 30a and 30b, a first circuit component mounted on the main surface 30a, a second circuit component mounted on the main surface 30b, an external connection terminal arranged on the main surface 30b side relative to the main surface 30a with respect to the mounting substrate, a long via conductor connected to the first circuit component, passing through the mounting substrate, and having a substantially long shape when the mounting substrate is viewed in a plan view, and a metal block arranged on the main surface 30b side relative to the main surface 30a with respect to the mounting substrate and connecting the long via conductor and the external connection terminal. When the mounting substrate is viewed in a plan view, the first circuit component overlaps the long via conductor and the metal block overlaps the long via conductor.

公开(公告)号：US20250070718A1

公开(公告)日：2025-02-27

申请号：US18943524

申请日：2024-11-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： John HOVERSTEN ,  David Perreault ,  Yevgeniy Tkachenko ,  Takeshi Kogure ,  Yuuki Fukuda ,  Toshiki Matsui ,  Yuuma Noguchi ,  Kiichiro Takenaka

IPC: H03F1/02 ,  H03F3/213

Abstract: An amplifier circuit is provided for amplifying a radio frequency signal within one frame of a radio frequency signal by using multiple discrete voltages supplied from the tracker circuit. The amplifier circuit includes a power amplifier and an RC series circuit including a resistor and a capacitor that are connected in series between the ground and a voltage supply path between the tracker circuit and the power amplifier.

公开(公告)号：US11476226B2

公开(公告)日：2022-10-18

申请号：US16727141

申请日：2019-12-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takanori Uejima ,  Yuji Takematsu ,  Naoya Matsumoto ,  Shou Matsumoto ,  Tetsuro Harada ,  Dai Nakagawa ,  Yutaka Sasaki ,  Yuuki Fukuda

IPC: H03F1/56 ,  H04B1/40 ,  H01L23/00 ,  H01L23/66 ,  H03F3/24 ,  H03F3/68 ,  H01L23/31 ,  H01L23/552 ,  H01L25/18 ,  H01L23/538

Abstract: A radio-frequency module includes: a transmitting circuit disposed on a mounting substrate to process a radio-frequency signal input from a transmission terminal and to output a resultant signal to a common terminal; a receiving circuit disposed on the mounting substrate to process a radio-frequency signal input from the common terminal and to output a resultant signal to a reception terminal; a first inductor included in a first transmitting circuit; and a bonding wire connected to the ground and bridging over the first inductor.