Invention Grant
- Patent Title: MIM capacitor and manufacturing method therefor
-
Application No.: US17263285Application Date: 2019-11-11
-
Publication No.: US11476324B2Publication Date: 2022-10-18
- Inventor: Hongfeng Jin
- Applicant: CSMC TECHNOLOGIES FAB2 CO., LTD.
- Applicant Address: CN Wuxi
- Assignee: CSMC TECHNOLOGIES FAB2 CO., LTD.
- Current Assignee: CSMC TECHNOLOGIES FAB2 CO., LTD.
- Current Assignee Address: CN Wuxi
- Agency: Dority & Manning, P.A.
- Priority: CN201811364078.6 20181116
- International Application: PCT/CN2019/116996 WO 20191111
- International Announcement: WO2020/098581 WO 20200522
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01L23/522 ; H01L21/311

Abstract:
An MIM capacitor and a manufacturing method therefor. The manufacturing method comprises: providing a semiconductor substrate, and forming a first metal layer on the semiconductor substrate; forming an anti-reflection layer on the first metal layer; performing photoetching and etching on the first metal layer and the anti-reflection layer so as to define an MIM capacitor region, wherein the first metal layer in the MIM capacitor region serves as a lower electrode plate of the MIM capacitor, and the anti-reflection layer in the MIM capacitor region serves as a dielectric layer of the MIM capacitor; and forming an upper electrode plate of the MIM capacitor on the anti-reflection layer in the MIM capacitor region.
Public/Granted literature
- US20210296428A1 MIM Capacitor and Manufacturing Method Therefor Public/Granted day:2021-09-23
Information query
IPC分类: