Invention Grant
- Patent Title: Integrated circuit structure and method for bipolar transistor stack within substrate
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Application No.: US17173611Application Date: 2021-02-11
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Publication No.: US11488950B2Publication Date: 2022-11-01
- Inventor: Uzma B. Rana , Vibhor Jain , Anthony K. Stamper , Qizhi Liu , Siva P. Adusumilli
- Applicant: GLOBALFOUNDRIES U.S. Inc.
- Applicant Address: US CA Santa Clara
- Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Hoffman Warnick LLC
- Agent Anthony Canale
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L29/732 ; H01L21/8249 ; H01L29/66 ; H01L29/10 ; H01L29/08 ; H01L29/737 ; H01L29/73

Abstract:
Aspects of the disclosure provide an integrated circuit (IC) structure with a bipolar transistor stack within a substrate. The bipolar transistor stack may include: a collector, a base on the collector, and an emitter on a first portion of the base. A horizontal width of the emitter is less than a horizontal width of the base, and an upper surface of the emitter is substantially coplanar with an upper surface of the substrate. An extrinsic base structure is on a second portion of the base of the bipolar transistor stack, and horizontally adjacent the emitter. The extrinsic base structure includes an upper surface above the upper surface of the substrate.
Public/Granted literature
- US20220254774A1 INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR BIPOLAR TRANSISTOR STACK WITHIN SUBSTRATE Public/Granted day:2022-08-11
Information query
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