Invention Grant
- Patent Title: Bathtub integrated heat spreader with multiple thermal-interface material for integrated-circuit packages
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Application No.: US17025899Application Date: 2020-09-18
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Publication No.: US11495514B2Publication Date: 2022-11-08
- Inventor: Chew Ching Lim , Chun Howe Sim
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Priority: MYPI2019007403 20191211
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/40
Abstract:
Disclosed embodiments include multiple thermal-interface material at the interface between an integrated heat spreader and a heat sink. A primary thermal-interface material has flow qualities and a secondary thermal-interface material has containment and adhesive qualities. The integrated heat spreader has a basin form factor that contains the primary thermal-interface material.
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