A mounting method is a method for mounting a diced semiconductor chip having a first face that is held on a carrier substrate and a second face that is an opposite face of the first face on a circuit board placed on a mounting table. The mounting method includes affixing the second face of the semiconductor chip to an adhesive sheet, removing the carrier substrate from the semiconductor chip, reducing an adhesive strength of the adhesive sheet, and mounting the semiconductor chip on the circuit board by holding a first face side of the semiconductor chip with a head to separate the semiconductor chip from the adhesive sheet, and joining a second face side of the semiconductor chip to the circuit board.