Invention Grant
- Patent Title: Device comprising multi-directional antennas in substrates coupled through flexible interconnects
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Application No.: US16810621Application Date: 2020-03-05
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Publication No.: US11495873B2Publication Date: 2022-11-08
- Inventor: Jeahyeong Han , Rajneesh Kumar , Suhyung Hwang , Jaehyun Yeon , Mohammad Ali Tassoudji , Darryl Sheldon Jessie , Ameya Galinde
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza, LLP
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01L21/56 ; H01L23/31 ; H01L23/538 ; H01L23/552 ; H01L23/66 ; H01Q1/36 ; H01Q1/52 ; H05K1/18 ; H05K9/00 ; H01L21/48 ; H01L23/00 ; H01L25/16
Abstract:
A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.
Public/Granted literature
- US20210280959A1 DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED THROUGH FLEXIBLE INTERCONNECTS Public/Granted day:2021-09-09
Information query
