公开(公告)号：US20210410274A1

公开(公告)日：2021-12-30

申请号：US17100121

申请日：2020-11-20

Applicant: QUALCOMM Incorporated

Inventor： Jeahyeong Han ,  Suhyung Hwang ,  Mina Iskander ,  Rajneesh Kumar ,  Darryl Sheldon Jessie

IPC: H05K1/02 ,  H01Q21/06 ,  H01Q1/48 ,  H01Q1/22

Abstract: Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.

公开(公告)号：US11756894B2

公开(公告)日：2023-09-12

申请号：US16879517

申请日：2020-05-20

Applicant: QUALCOMM Incorporated

Inventor： Jeahyeong Han ,  Rajneesh Kumar ,  Jeongil Jay Kim ,  Chin-Kwan Kim

IPC: H01L23/552 ,  H01L21/48 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00 ,  H01Q1/22 ,  H01Q1/52

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/16 ,  H01Q1/2283 ,  H01Q1/526 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/3025

Abstract: Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employing a substrate sidewall partial shield for electro-magnetic interference (EMI) shielding. A RFIC package includes an IC die layer that includes a RFIC die(s) mounted on a substrate that includes substrate metallization layers, a substrate core, and substrate antenna layers. The RFIC package includes an EMI shield surrounding the IC die layer and extending down shared sidewalls of the IC die layer and the substrate. The EMI shield extends down the sidewalls of the IC die layer and substrate metallization layers of the substrate to at least the interface between the substrate metallization layers and the substrate core, and without extending adjacent to the sidewall of the substrate antenna layers. In this manner, antenna performance of the antenna module may not be degraded, because extending the EMI shield down sidewalls of the substrate antenna layers can create a resonance cavity in the substrate.

公开(公告)号：US11658391B2

公开(公告)日：2023-05-23

申请号：US17129084

申请日：2020-12-21

Applicant: QUALCOMM Incorporated

Inventor： Hong Bok We ,  Aniket Patil ,  Jeahyeong Han ,  Mohammad Ali Tassoudji

IPC: H01Q1/52 ,  H01Q21/00 ,  H01Q23/00 ,  H01Q1/22

CPC classification number: H01Q1/2283 ,  H01Q1/526 ,  H01Q21/0087 ,  H01L2223/6677 ,  H01Q23/00

Abstract: Aspects disclosed herein include a device including a first antenna substrate including one or more antennas. The device also includes a metallization structure. The device also includes a first spacer disposed between the first antenna substrate and the metallization structure, configured to maintain a constant distance between the first antenna substrate and the metallization structure. The device also includes a first plurality of conductive elements, disposed within the first spacer, configured to electrically couple the first antenna substrate to the metallization structure. The device also includes where the first spacer is configured to enclose all the conductive elements, electrically coupled to the first antenna substrate, and is configured to form an air gap between the first antenna substrate and the metallization structure. The device also includes where the first plurality of conductive elements is separated by air in the air gap.

公开(公告)号：US11670599B2

公开(公告)日：2023-06-06

申请号：US16925217

申请日：2020-07-09

Applicant: QUALCOMM Incorporated

Inventor： Jeahyeong Han ,  David Fraser Rae ,  Rajneesh Kumar

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/64

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/647

Abstract: Packages are configured to include an electromagnetic interference (EMI) shield. According to one example, a package includes a substrate, an electrical component, and an EMI shield. The substrate includes a first surface and a second surface. The electrical component may be coupled to the first side of the substrate. The EMI shield is formed with at least one passive device. The at least one passive device is coupled to the first surface of the substrate. The at least one passive device is located laterally to the at least one electrical component, and extends along at least a portion of the electrical component. Other aspects, embodiments, and features are also included.

公开(公告)号：US20210366838A1

公开(公告)日：2021-11-25

申请号：US16879517

申请日：2020-05-20

Applicant: QUALCOMM Incorporated

Inventor： Jeahyeong Han ,  Rajneesh Kumar ,  Jeongil Jay Kim ,  Chin-Kwan Kim

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/498 ,  H01L23/66 ,  H01L21/48 ,  H01Q1/22 ,  H01Q1/52

Abstract: Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employing a substrate sidewall partial shield for electro-magnetic interference (EMI) shielding. A RFIC package includes an IC die layer that includes a RFIC die(s) mounted on a substrate that includes substrate metallization layers, a substrate core, and substrate antenna layers. The RFIC package includes an EMI shield surrounding the IC die layer and extending down shared sidewalls of the IC die layer and the substrate. The EMI shield extends down the sidewalls of the IC die layer and substrate metallization layers of the substrate to at least the interface between the substrate metallization layers and the substrate core, and without extending adjacent to the sidewall of the substrate antenna layers. In this manner, antenna performance of the antenna module may not be degraded, because extending the EMI shield down sidewalls of the substrate antenna layers can create a resonance cavity in the substrate.

公开(公告)号：US11696390B2

公开(公告)日：2023-07-04

申请号：US17100121

申请日：2020-11-20

Applicant: QUALCOMM Incorporated

Inventor： Jeahyeong Han ,  Suhyung Hwang ,  Mina Iskander ,  Rajneesh Kumar ,  Darryl Sheldon Jessie

IPC: H01Q1/22 ,  H01Q1/52 ,  H01Q21/29 ,  H01Q23/00 ,  H05K1/02 ,  H01Q1/48 ,  H01Q21/06 ,  H05K1/18

CPC classification number: H05K1/0219 ,  H01Q1/2283 ,  H01Q1/48 ,  H01Q1/526 ,  H01Q21/061 ,  H05K1/0225 ,  H05K1/0227 ,  H05K1/0278 ,  H01Q21/29 ,  H01Q23/00 ,  H05K1/181 ,  H05K2201/09609 ,  H05K2201/09681 ,  H05K2201/10098

Abstract: Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.

公开(公告)号：US11495873B2

公开(公告)日：2022-11-08

申请号：US16810621

申请日：2020-03-05

Applicant: QUALCOMM Incorporated

Inventor： Jeahyeong Han ,  Rajneesh Kumar ,  Suhyung Hwang ,  Jaehyun Yeon ,  Mohammad Ali Tassoudji ,  Darryl Sheldon Jessie ,  Ameya Galinde

IPC: H01Q1/22 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/36 ,  H01Q1/52 ,  H05K1/18 ,  H05K9/00 ,  H01L21/48 ,  H01L23/00 ,  H01L25/16

Abstract: A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.

公开(公告)号：US11139224B2

公开(公告)日：2021-10-05

申请号：US16704789

申请日：2019-12-05

Applicant: QUALCOMM Incorporated

Inventor： Chaoqi Zhang ,  Rajneesh Kumar ,  Li-Sheng Weng ,  Darryl Sheldon Jessie ,  Suhyung Hwang ,  Jeahyeong Han ,  Xiaoming Chen ,  Jaehyun Yeon

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/56 ,  H01L21/67 ,  H01L23/31

Abstract: A package that includes a substrate having a routing region and a non-routing region along a periphery of the substrate. The non-routing region includes a plurality of vias configured as a shield. The package includes an integrated device coupled to the substrate, and an encapsulation layer located over the substrate such that the encapsulation layer encapsulates the integrated device.