Invention Grant
- Patent Title: Heat dissipation device formed of nonmetallic material and electronic device including the same
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Application No.: US16577835Application Date: 2019-09-20
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Publication No.: US11497141B2Publication Date: 2022-11-08
- Inventor: Kyungha Koo , Kuntak Kim , Jihong Kim , Hongki Moon , Hajoong Yun , Haejin Lee , Seyoung Jang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: The Farrell Law Firm, P.C.
- Priority: KR10-2018-0113215 20180920
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F21/06 ; F28D15/04

Abstract:
A heat dissipation device is provided. The heat dissipation device includes a container including a first plate, and a second plate spaced apart from the first plate to define an interior space, at least one filler disposed between the first plate and the second plate and configured to support the first plate and the second plate, a wick layer located on an inner wall defined in the interior space by the first plate or the second plate, and a working fluid configured to flow in the interior space in a gaseous state, and flow in the wick layer in a liquefied state, wherein the container further includes a fluoride-based polymer having a predetermined gas permeability.
Public/Granted literature
- US20200100390A1 HEAT DISSIPATION DEVICE FORMED OF NONMETALLIC MATERIAL AND ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2020-03-26
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