- 专利标题: Heat dissipation device formed of nonmetallic material and electronic device including the same
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申请号: US16577835申请日: 2019-09-20
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公开(公告)号: US11497141B2公开(公告)日: 2022-11-08
- 发明人: Kyungha Koo , Kuntak Kim , Jihong Kim , Hongki Moon , Hajoong Yun , Haejin Lee , Seyoung Jang
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Gyeonggi-do
- 代理机构: The Farrell Law Firm, P.C.
- 优先权: KR10-2018-0113215 20180920
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; F28F21/06 ; F28D15/04
摘要:
A heat dissipation device is provided. The heat dissipation device includes a container including a first plate, and a second plate spaced apart from the first plate to define an interior space, at least one filler disposed between the first plate and the second plate and configured to support the first plate and the second plate, a wick layer located on an inner wall defined in the interior space by the first plate or the second plate, and a working fluid configured to flow in the interior space in a gaseous state, and flow in the wick layer in a liquefied state, wherein the container further includes a fluoride-based polymer having a predetermined gas permeability.
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