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    Method for controlling cooling fan and wireless charging device
    3.
    发明授权
    Method for controlling cooling fan and wireless charging device 有权

    公开(公告)号：US11632881B2

    公开(公告)日：2023-04-18

    申请号：US16952595

    申请日：2020-11-19

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Chihwan Jeong ,  Kyungha Koo ,  Jihong Kim ,  Dongku Kang ,  Kuntak Kim ,  Yunjeong Park ,  Kyuhwan Lee ,  Haejin Lee ,  Seyoung Jang ,  Hyuntae Jang

    IPC: H05K7/20 ,  H02J7/02 ,  H02J50/10 ,  H02J7/00

    Abstract: The disclosure relates to a wireless charging device including a cooling fan, and the wireless charging device according to an embodiment of the disclosure includes: a housing including a holding portion configured to hold an external electronic device; a first bracket positioned in the holding portion; a conductive coil disposed in the first bracket; a second bracket positioned in the holding portion and including a penetrating hole; a first cooling fan positioned in the penetrating hole; a second cooling fan positioned in the penetrating hole and spaced apart from the first cooling fan; and a partition formed in the penetrating hole to isolate the first cooling fan and the second cooling fan from each other, the penetrating hole being divided into a first area having the first cooling fan disposed therein and a second area having the second cooling fan positioned therein, at least one protrusion having a volute shape formed on at least a portion of the second bracket or at least a portion of the partition, a first opening formed on at least an area of the first bracket to allow air cooled by the first cooling fan and/or the second cooling fan to move to the holding portion, and a second opening formed on at least an area of the holding portion to allow the air transmitted from the first opening to move outside the wireless charging device.

    Electronic device including heat dissipation structure
    6.
    发明授权
    Electronic device including heat dissipation structure 有权

    公开(公告)号：US12204384B2

    公开(公告)日：2025-01-21

    申请号：US17869109

    申请日：2022-07-20

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Joseph Ahn ,  Kyungha Koo ,  Hongki Moon

    IPC: G06F1/16 ,  G06F1/20 ,  H04M1/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/04 ,  H05K7/20

    Abstract: According to various embodiments of the disclosure, an electronic device may include: a housing, a display accommodated inside the housing, a support supporting the display and including a opening and a side wall surrounding the opening, and a heat dissipation structure at least a portion of which is positioned in the opening and bonded to the side wall, wherein the heat dissipation structure may include a heat dissipation layer having a first thermal conductivity and a protective layer having a second thermal conductivity, is the second thermal conductivity being lower than the first thermal conductivity, the protective layer covering at least a portion of the heat dissipation layer.

    Electronic device having heat collection/diffusion structure
    9.
    发明授权
    Electronic device having heat collection/diffusion structure 有权

    公开(公告)号：US11098959B2

    公开(公告)日：2021-08-24

    申请号：US17094293

    申请日：2020-11-10

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Haejin Lee ,  Kyungha Koo ,  Chunghyo Jung ,  Se-Young Jang ,  Jungje Bang ,  Jaeheung Ye ,  Chi-Hyun Cho

    IPC: H05K7/20 ,  F28D15/02 ,  G06F1/20 ,  H04M1/02 ,  H05K9/00 ,  H01L23/427

    Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

    Electronic device having heat collection/diffusion structure
    10.
    发明授权
    Electronic device having heat collection/diffusion structure 有权

    公开(公告)号：US10798849B2

    公开(公告)日：2020-10-06

    申请号：US16515275

    申请日：2019-07-18

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Haejin Lee ,  Kyungha Koo ,  Chunghyo Jung ,  Se-Young Jang ,  Jungje Bang ,  Jaeheung Ye ,  Chi-Hyun Cho

    IPC: H05K7/20 ,  F28D15/02 ,  H01L23/427 ,  G06F1/20 ,  H05K9/00

    Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

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