- 专利标题： Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing method
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申请号： US17511203申请日： 2021-10-26
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公开(公告)号： US11525984B2公开(公告)日： 2022-12-13
- 发明人: Yusuke Moriya , Masanori Iwasaki , Takashi Oinoue , Yoshiya Hagimoto , Hiroyasu Matsugai , Hiroyuki Itou , Suguru Saito , Keiji Ohshima , Nobutoshi Fujii , Hiroshi Tazawa , Toshiaki Shiraiwa , Minoru Ishida
- 申请人： SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- 申请人地址： JP Kanagawa
- 专利权人： SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- 当前专利权人： SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- 当前专利权人地址： JP Kanagawa
- 代理机构： Sheridan Ross P.C.
- 优先权： JP2015-152920 20150731
- 主分类号： G02B13/00
- IPC分类号： G02B13/00 ; B29D11/00 ; G02B3/00 ; G02B5/00 ; G02B27/00
摘要：
The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.
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