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公开(公告)号：US12015037B2
公开(公告)日：2024-06-18
申请号：US17044994
申请日：2019-01-17
发明人： Yusuke Moriya
IPC分类号： H01L27/146 , G02B5/20
CPC分类号： H01L27/14605 , G02B5/208 , H01L27/14621 , H01L27/14627 , H01L27/14685
摘要： To prevent the occurrence of a defect in an infrared-light attenuation filter and prevent a reduction in image quality. An imaging device includes a photoelectric converter, an on-chip lens, a color filter, the infrared-light attenuation filter, and a protective film. The photoelectric converter performs photoelectric conversion depending on incident light. The on-chip lens collects the incident light into the photoelectric converter. Infrared light and visible light of a specified wavelength from among the collected incident light are transmitted through the color filter. The infrared-light attenuation filter attenuates the infrared light from among the collected incident light, and visible light from among the collected incident light is transmitted through the infrared-light attenuation filter. The protective film is arranged adjacent to the infrared-light attenuation filter and protects the infrared-light attenuation filter.
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公开(公告)号：US12074180B2
公开(公告)日：2024-08-27
申请号：US16976749
申请日：2019-01-21
IPC分类号： H01L27/146 , G02B1/04 , G02B1/11
CPC分类号： H01L27/14618 , G02B1/041 , G02B1/11 , H01L27/1462 , H01L27/14621 , H01L27/14623 , H01L27/14627 , H01L27/1464 , H01L27/14645 , H01L27/14685
摘要： To reduce reflection of incident light in an imaging element having a transparent resin arranged on a surface of a microlens. The imaging element includes a pixel, a microlens, a transparent resin layer, and a sealing glass. The pixel is formed on a semiconductor substrate and generates an image signal according to radiated light. The microlens is arranged adjacent to the pixel, collects incident light, irradiates the pixel with the incident light, and flattens a surface of the pixel. The transparent resin layer is arranged adjacent to the microlens and has a refractive index different from a refractive index of the microlens by a predetermined difference. The sealing glass is arranged adjacent to the transparent resin and seals the semiconductor substrate.
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公开(公告)号：US11525984B2
公开(公告)日：2022-12-13
申请号：US17511203
申请日：2021-10-26
发明人： Yusuke Moriya , Masanori Iwasaki , Takashi Oinoue , Yoshiya Hagimoto , Hiroyasu Matsugai , Hiroyuki Itou , Suguru Saito , Keiji Ohshima , Nobutoshi Fujii , Hiroshi Tazawa , Toshiaki Shiraiwa , Minoru Ishida
摘要： The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.
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公开(公告)号：US11543621B2
公开(公告)日：2023-01-03
申请号：US16478090
申请日：2018-01-16
发明人： Munekatsu Fukuyama , Hiroyasu Matsugai , Hiroyuki Itou , Suguru Saito , Keiji Ohshima , Masanori Iwasaki , Toshihiko Hayashi , Shuzo Sato , Nobutoshi Fujii , Hiroshi Tazawa , Toshiaki Shiraiwa , Yusuke Moriya , Minoru Ishida
摘要： There is provided a camera module including a stacked lens structure including a plurality of lens substrates. The plurality of lens substrates includes a first lens substrate including a first lens that is disposed at an inner side of a through-hole formed in the first lens substrate, and a second lens substrate including a second lens that is disposed at an inner side of a through-hole formed in the second lens substrate, wherein the first lens substrate is directly bonded to the second lens substrate. The camera module further includes an electromagnetic drive unit configured to adjust a distance between the stacked lens structure and a light-receiving element.
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公开(公告)号：US10379323B2
公开(公告)日：2019-08-13
申请号：US15559489
申请日：2016-07-15
发明人： Yusuke Moriya , Masanori Iwasaki , Takashi Oinoue , Yoshiya Hagimoto , Hiroyasu Matsugai , Hiroyuki Itou , Suguru Saito , Keiji Ohshima , Nobutoshi Fujii , Hiroshi Tazawa , Toshiaki Shiraiwa , Minoru Ishida
摘要： The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.
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公开(公告)号：US11194135B2
公开(公告)日：2021-12-07
申请号：US16507984
申请日：2019-07-10
发明人： Yusuke Moriya , Masanori Iwasaki , Takashi Oinoue , Yoshiya Hagimoto , Hiroyasu Matsugai , Hiroyuki Itou , Suguru Saito , Keiji Ohshima , Nobutoshi Fujii , Hiroshi Tazawa , Toshiaki Shiraiwa , Minoru Ishida
摘要： The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.
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