Invention Grant
- Patent Title: Wafer cleaning apparatus based on light irradiation and wafer cleaning system including the same
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Application No.: US16744667Application Date: 2020-01-16
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Publication No.: US11527399B2Publication Date: 2022-12-13
- Inventor: Byungkwon Cho , Sangjine Park , Yongsun Ko , Seulgee Jeon , Jihoon Jeong , Seongsik Hong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR10-2019-0068277 20190610
- Main IPC: H01L21/02
- IPC: H01L21/02 ; B08B7/00 ; H01L21/67

Abstract:
Provided are a wafer cleaning apparatus based on light irradiation capable of effectively cleaning residue on a wafer without damaging the wafer, and a wafer cleaning system including the cleaning apparatus. The wafer cleaning apparatus is configured to clean residue on the wafer by light irradiation and includes: a light irradiation unit configured to irradiate light onto the wafer during the light irradiation; a wafer processing unit configured accommodate the wafer and to control a position of the wafer such that the light is irradiated onto the wafer during the light irradiation; and a cooling unit configured to cool the wafer after the light irradiation has been completed. The light irradiation unit, the wafer processing unit, and the cooling unit are sequentially arranged in a vertical structure with the light irradiation unit above the wafer processing unit and the wafer processing unit above the cooling unit.
Information query
IPC分类: