公开(公告)号：US11527399B2

公开(公告)日：2022-12-13

申请号：US16744667

申请日：2020-01-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byungkwon Cho ,  Sangjine Park ,  Yongsun Ko ,  Seulgee Jeon ,  Jihoon Jeong ,  Seongsik Hong

IPC: H01L21/02 ,  B08B7/00 ,  H01L21/67

Abstract: Provided are a wafer cleaning apparatus based on light irradiation capable of effectively cleaning residue on a wafer without damaging the wafer, and a wafer cleaning system including the cleaning apparatus. The wafer cleaning apparatus is configured to clean residue on the wafer by light irradiation and includes: a light irradiation unit configured to irradiate light onto the wafer during the light irradiation; a wafer processing unit configured accommodate the wafer and to control a position of the wafer such that the light is irradiated onto the wafer during the light irradiation; and a cooling unit configured to cool the wafer after the light irradiation has been completed. The light irradiation unit, the wafer processing unit, and the cooling unit are sequentially arranged in a vertical structure with the light irradiation unit above the wafer processing unit and the wafer processing unit above the cooling unit.

公开(公告)号：US11302526B2

公开(公告)日：2022-04-12

申请号：US16561078

申请日：2019-09-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangjine Park ,  Byung-Kwon Cho ,  Jihoon Jeong ,  Youngtak Kim ,  Yongsun Ko ,  Seulgee Jeon

IPC: H01L21/02 ,  H01L21/67

Abstract: A supercritical drying apparatus and a method of drying a substrate, the apparatus including a drying chamber configured to receive a supercritical fluid and to dry a substrate; a chuck in the drying chamber, the chuck being configured to receive the substrate; and a particle remover in the drying chamber, the particle remover being configured to remove dry particles from the substrate by heating the substrate with radiant heat.