Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16526025Application Date: 2019-07-30
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Publication No.: US11527645B2Publication Date: 2022-12-13
- Inventor: Tadayoshi Uechi , Takashi Izumida , Takeshi Shimane
- Applicant: KIOXIA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: KIOXIA CORPORATION
- Current Assignee: KIOXIA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JPJP2019-049086 20190315
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/10 ; H01L29/08

Abstract:
A semiconductor device of an embodiment includes: a first and second semiconductor regions of a first conductivity type; a third semiconductor region of a second conductivity type disposed between the first and second semiconductor regions; a fourth semiconductor region of the first conductivity type disposed below the first semiconductor region; a fifth semiconductor region of the first conductivity type disposed below the second semiconductor region; a first region containing carbon disposed between the first and fourth semiconductor regions; a second region containing carbon disposed between the second and fifth semiconductor regions; a third region disposed between the first and second regions; the first and second regions having a first and second carbon concentrations respectively, the third region not containing carbon or having a lower carbon concentration than the first and second carbon concentrations in a portion below an end of a lower face of a gate electrode.
Public/Granted literature
- US20200295191A1 SEMICONDUCTOR DEVICE Public/Granted day:2020-09-17
Information query
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