Invention Grant
- Patent Title: Method for fabricating semiconductor chip by using multi-curing apparatus and multi-curing apparatus
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Application No.: US16375157Application Date: 2019-04-04
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Publication No.: US11532328B2Publication Date: 2022-12-20
- Inventor: Won Young Jee , Sung Ki Roh , Min Uk Kim , Sung Soo Kim , Woong Sik Nam , Sung-Gyu Park , Se Young Oh
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2018-0057101 20180518,KR10-2019-0013502 20190201
- Main IPC: B05D3/06
- IPC: B05D3/06 ; G11B7/095 ; F01C1/12 ; H01L21/67

Abstract:
A multi-curing apparatus includes an actuator, a first chamber including a first energy source head, a second chamber including a second energy source head, a first driver including a first rotation transmission gear gear-engaged with the actuator, and a first driving gear gear-engaged with the first chamber. The apparatus further includes a second driver including a second rotation transmission gear gear-engaged with the actuator, and a second driving gear gear-engaged with the second chamber. The apparatus aligns a position of the first chamber with reference to a position of the second chamber while the first rotation transmission gear, the second rotation transmission gear, and the second driving gear are fixed.
Public/Granted literature
- US20190351449A1 METHOD FOR FABRICATING SEMICONDUCTOR CHIP BY USING MULTI-CURING APPARATUS AND MULTI-CURING APPARATUS Public/Granted day:2019-11-21
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