- 专利标题: Gate-all-around integrated circuit structures having germanium nanowire channel structures
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申请号: US16370449申请日: 2019-03-29
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公开(公告)号: US11532734B2公开(公告)日: 2022-12-20
- 发明人: Cory Bomberger , Anand Murthy , Susmita Ghose , Zachary Geiger
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwabe, Williamson & Wyatt, P.C.
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L29/78 ; H01L29/06 ; H01L29/34 ; H01L29/08 ; H01L21/02 ; H01L29/423
摘要:
Gate-all-around integrated circuit structures having germanium nanowire channel structures, and methods of fabricating gate-all-around integrated circuit structures having germanium nanowire channel structures, are described. For example, an integrated circuit structure includes a vertical arrangement of horizontal nanowires above a fin, each of the nanowires including germanium, and the fin including a defect modification layer on a first semiconductor layer, a second semiconductor layer on the defect modification layer, and a third semiconductor layer on the second semiconductor layer. A gate stack is around the vertical arrangement of horizontal nanowires. A first epitaxial source or drain structure is at a first end of the vertical arrangement of horizontal nanowires, and a second epitaxial source or drain structure is at a second end of the vertical arrangement of horizontal nanowires.
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