Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US16878040Application Date: 2020-05-19
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Publication No.: US11538700B2Publication Date: 2022-12-27
- Inventor: Go Ayabe
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JPJP2019-095493 20190521
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/67 ; H01L21/687 ; B08B3/08 ; B65G47/90

Abstract:
There is provided a substrate processing apparatus, including: a mounting part on which a carrier having a plurality of slots capable of accommodating a plurality of substrates is mounted; a transfer part configured to load and unload the substrates to and from the plurality of slots based on a reference accommodation position set in the mounting part; a detection part configured to detect a position of each of the plurality of substrates accommodated in the plurality of slots; and a correction part configured to correct the reference accommodation position based on port accumulation information in which detection results obtained by the detection part from a plurality of carriers which has been mounted on the mounting part in the past are accumulated.
Public/Granted literature
- US20200373179A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2020-11-26
Information query
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