发明授权
- 专利标题： Substrate positioning apparatus, substrate positioning method, and bonding apparatus
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申请号： US17164928申请日： 2021-02-02
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公开(公告)号： US11545383B2公开(公告)日： 2023-01-03
- 发明人: Tetsuya Maki , Toshifumi Inamasu
- 申请人： Tokyo Electron Limited
- 申请人地址： JP Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo
- 代理机构： Pearne & Gordon LLP
- 优先权： JPJP2020-020272 20200210
- 主分类号： H01L21/68
- IPC分类号： H01L21/68 ; H01L23/00 ; H01L21/683 ; H01L21/677 ; F16C29/02 ; H01L21/687
摘要：
A substrate positioning apparatus includes a holder and a rotating device. The holder is configured to hold a substrate. The rotating device is configured to rotate the holder. The rotating device includes a rotation shaft, a bearing member, a base member, a driving unit and a damping device. The rotation shaft is fixed to the holder. The bearing member is configured to support the rotation shaft in a non-contact state. The bearing member is fixed on the base member. The driving unit is configured to rotate the rotation shaft. The damping device includes a rail connected to the base member and a slider connected to the rotation shaft, and is configured to produce a damping force against a relative operation between the rotation shaft and the base member by a resistance generated between the rail and the slider.
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