Invention Grant
- Patent Title: Electromagnetic dielectric structure adhered to a substrate and methods of making the same
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Application No.: US17543195Application Date: 2021-12-06
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Publication No.: US11545753B2Publication Date: 2023-01-03
- Inventor: Stephen O'Connor , Gianni Taraschi , Christopher Brown , Kristi Pance , Karl E. Sprentall , Bruce Fitts , Dirk Baars , William Blasius , Murali Sethumadhavan , Roshin Rose George , Michael S. White , Michael Lunt , Sam Henson , John Dobrick
- Applicant: ROGERS CORPORATION
- Applicant Address: US AZ Chandler
- Assignee: ROGERS CORPORATION
- Current Assignee: ROGERS CORPORATION
- Current Assignee Address: US AZ Chandler
- Agency: Cantor Colburn LLP
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H01Q1/38

Abstract:
An electromagnetic, EM, device, includes: a substrate having a dielectric layer and a first conductive layer at a first side of the substrate, the substrate having a via that extends at least partially through the substrate from the first side toward an opposing second side of the substrate; at least one dielectric structure having at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having a first average dielectric constant, the at least one dielectric structure further having a second dielectric portion that is contiguous with the first dielectric portion; wherein the second dielectric portion extends into the via of the substrate, the via having a mechanical interlock surface; and wherein the at least one dielectric structure includes a mechanical interlock between the second dielectric portion and the mechanical interlock surface of the via of the substrate.
Public/Granted literature
- US20220158351A1 ELECTROMAGNETIC DIELECTRIC STRUCTURE ADHERED TO A SUBSTRATE AND METHODS OF MAKING THE SAME Public/Granted day:2022-05-19
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