公开(公告)号：US20220158351A1

公开(公告)日：2022-05-19

申请号：US17543195

申请日：2021-12-06

Applicant: ROGERS CORPORATION

Inventor： Stephen O'Connor ,  Gianni Taraschi ,  Christopher Brown ,  Kristi Pance ,  Karl E. Sprentall ,  Bruce Fitts ,  Dirk Baars ,  William Blasius ,  Murali Sethumadhavan ,  Roshin Rose George ,  Michael S. White ,  Michael Lunt ,  Sam Henson ,  John Dobrick

IPC: H01Q9/04 ,  H01Q1/38

Abstract: An electromagnetic, EM, device, includes: a substrate having a dielectric layer and a first conductive layer at a first side of the substrate, the substrate having a via that extends at least partially through the substrate from the first side toward an opposing second side of the substrate; at least one dielectric structure having at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having a first average dielectric constant, the at least one dielectric structure further having a second dielectric portion that is contiguous with the first dielectric portion; wherein the second dielectric portion extends into the via of the substrate, the via having a mechanical interlock surface; and wherein the at least one dielectric structure includes a mechanical interlock between the second dielectric portion and the mechanical interlock surface of the via of the substrate.

公开(公告)号：US20190341696A1

公开(公告)日：2019-11-07

申请号：US16396943

申请日：2019-04-29

Applicant: ROGERS CORPORATION

Inventor： Stephen O'Connor ,  Gianni Taraschi ,  Christopher Brown ,  Kristi Pance ,  Karl E. Sprentall ,  Bruce Fitts ,  Dirk Baars ,  William Blasius ,  Murali Sethumadhavan ,  Roshin Rose George ,  Michael S. White ,  Michael Lunt ,  Sam Henson ,  John Dobrick

IPC: H01Q9/04 ,  H01Q1/38

Abstract: In an embodiment, an electromagnetic device, comprises a substrate a substrate comprising a dielectric layer and a first conductive layer; at least one dielectric structure comprising at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having an average dielectric constant and an optional second dielectric portion that extends into an optional via. The at least one dielectric structure is bonded to the substrate by at least one of: a mechanical interlock between the second dielectric portion and the substrate due to the at least one interlocking slot comprising a retrograde surface; an intermediate layer located in between the dielectric structure and the substrate having a roughened surface; or an adhesive material located in between the dielectric structure and the substrate. A method of making the device can comprise injection molding a dielectric composition onto the substrate to form the dielectric substrate.

公开(公告)号：US20180254405A1

公开(公告)日：2018-09-06

申请号：US15903204

申请日：2018-02-23

Applicant: Rogers Corporation

Inventor： Karl E. Sprentall ,  Trevor Polidore ,  Robert Mone ,  Michael Lunt ,  William Kwan

IPC: H01L41/113 ,  H01L41/083 ,  G01L1/14 ,  G01L1/16 ,  H02N1/04 ,  H01L41/311 ,  H01L41/319

CPC classification number: H01L41/1132 ,  G01L1/14 ,  G01L1/142 ,  G01L1/16 ,  G01L5/0052 ,  H01L41/083 ,  H01L41/193 ,  H01L41/277 ,  H01L41/311 ,  H01L41/319 ,  H02N1/04 ,  H02N1/08

Abstract: A sensor apparatus includes a first of a plurality of layers having a top layer, a bottom layer, and at least one intermediate layer having an electrical conductor layer, each of the top layer, the bottom layer, and the at least one intermediate layer is disposed in direct contact with a respective adjacent layer. A second of the plurality of layers is disposed in direct contact with the first plurality of layers such that the bottom layer of the second plurality of layers is disposed in direct contact with the top layer of the first plurality of layers. The first and second plurality of layers are productive of a piezoelectric voltage absent of an external current producing device and in response to being deformed, and are productive of a change in capacitance in response to being deformed.

公开(公告)号：US11737366B2

公开(公告)日：2023-08-22

申请号：US15903204

申请日：2018-02-23

Applicant: Rogers Corporation

Inventor： Karl E. Sprentall ,  Trevor Polidore ,  Robert Mone ,  Michael Lunt ,  William Kwan

IPC: H01L41/113 ,  H10N30/30 ,  G01L1/14 ,  H02N1/04 ,  G01L1/16 ,  G01L5/00 ,  H02N1/08 ,  H10N30/50 ,  H10N30/057 ,  H10N30/071 ,  H10N30/079 ,  H10N30/857

CPC classification number: H10N30/302 ,  G01L1/14 ,  G01L1/142 ,  G01L1/16 ,  G01L5/0052 ,  H02N1/04 ,  H02N1/08 ,  H10N30/057 ,  H10N30/071 ,  H10N30/079 ,  H10N30/50 ,  H10N30/857

Abstract: A sensor apparatus includes a first of a plurality of layers having a top layer, a bottom layer, and at least one intermediate layer having an electrical conductor layer, each of the top layer, the bottom layer, and the at least one intermediate layer is disposed in direct contact with a respective adjacent layer. A second of the plurality of layers is disposed in direct contact with the first plurality of layers such that the bottom layer of the second plurality of layers is disposed in direct contact with the top layer of the first plurality of layers. The first and second plurality of layers are productive of a piezoelectric voltage absent of an external current producing device and in response to being deformed, and are productive of a change in capacitance in response to being deformed.

公开(公告)号：US11239563B2

公开(公告)日：2022-02-01

申请号：US16396943

申请日：2019-04-29

Applicant: ROGERS CORPORATION

Inventor： Stephen O'Connor ,  Gianni Taraschi ,  Christopher Brown ,  Kristi Pance ,  Karl E. Sprentall ,  Bruce Fitts ,  Dirk Baars ,  William Blasius ,  Murali Sethumadhavan ,  Roshin Rose George ,  Michael S. White ,  Michael Lunt ,  Sam Henson ,  John Dobrick

IPC: H01Q9/04 ,  H01Q1/38

Abstract: In an embodiment, an electromagnetic device, comprises a substrate a substrate comprising a dielectric layer and a first conductive layer; at least one dielectric structure comprising at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having an average dielectric constant and an optional second dielectric portion that extends into an optional via. The at least one dielectric structure is bonded to the substrate by at least one of: a mechanical interlock between the second dielectric portion and the substrate due to the at least one interlocking slot comprising a retrograde surface; an intermediate layer located in between the dielectric structure and the substrate having a roughened surface; or an adhesive material located in between the dielectric structure and the substrate. A method of making the device can comprise injection molding a dielectric composition onto the substrate to form the dielectric substrate.

公开(公告)号：US11545753B2

公开(公告)日：2023-01-03

申请号：US17543195

申请日：2021-12-06

Applicant: ROGERS CORPORATION

Inventor： Stephen O'Connor ,  Gianni Taraschi ,  Christopher Brown ,  Kristi Pance ,  Karl E. Sprentall ,  Bruce Fitts ,  Dirk Baars ,  William Blasius ,  Murali Sethumadhavan ,  Roshin Rose George ,  Michael S. White ,  Michael Lunt ,  Sam Henson ,  John Dobrick

IPC: H01Q9/04 ,  H01Q1/38

Abstract: An electromagnetic, EM, device, includes: a substrate having a dielectric layer and a first conductive layer at a first side of the substrate, the substrate having a via that extends at least partially through the substrate from the first side toward an opposing second side of the substrate; at least one dielectric structure having at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having a first average dielectric constant, the at least one dielectric structure further having a second dielectric portion that is contiguous with the first dielectric portion; wherein the second dielectric portion extends into the via of the substrate, the via having a mechanical interlock surface; and wherein the at least one dielectric structure includes a mechanical interlock between the second dielectric portion and the mechanical interlock surface of the via of the substrate.