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1.发明授权公开(公告)号：US11239563B2
公开(公告)日：2022-02-01
申请号：US16396943
申请日：2019-04-29
Applicant: ROGERS CORPORATION
Inventor： Stephen O'Connor , Gianni Taraschi , Christopher Brown , Kristi Pance , Karl E. Sprentall , Bruce Fitts , Dirk Baars , William Blasius , Murali Sethumadhavan , Roshin Rose George , Michael S. White , Michael Lunt , Sam Henson , John Dobrick
Abstract: In an embodiment, an electromagnetic device, comprises a substrate a substrate comprising a dielectric layer and a first conductive layer; at least one dielectric structure comprising at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having an average dielectric constant and an optional second dielectric portion that extends into an optional via. The at least one dielectric structure is bonded to the substrate by at least one of: a mechanical interlock between the second dielectric portion and the substrate due to the at least one interlocking slot comprising a retrograde surface; an intermediate layer located in between the dielectric structure and the substrate having a roughened surface; or an adhesive material located in between the dielectric structure and the substrate. A method of making the device can comprise injection molding a dielectric composition onto the substrate to form the dielectric substrate.
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2.发明申请公开(公告)号：US20220158351A1
公开(公告)日：2022-05-19
申请号：US17543195
申请日：2021-12-06
Applicant: ROGERS CORPORATION
Inventor： Stephen O'Connor , Gianni Taraschi , Christopher Brown , Kristi Pance , Karl E. Sprentall , Bruce Fitts , Dirk Baars , William Blasius , Murali Sethumadhavan , Roshin Rose George , Michael S. White , Michael Lunt , Sam Henson , John Dobrick
Abstract: An electromagnetic, EM, device, includes: a substrate having a dielectric layer and a first conductive layer at a first side of the substrate, the substrate having a via that extends at least partially through the substrate from the first side toward an opposing second side of the substrate; at least one dielectric structure having at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having a first average dielectric constant, the at least one dielectric structure further having a second dielectric portion that is contiguous with the first dielectric portion; wherein the second dielectric portion extends into the via of the substrate, the via having a mechanical interlock surface; and wherein the at least one dielectric structure includes a mechanical interlock between the second dielectric portion and the mechanical interlock surface of the via of the substrate.
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3.发明授权公开(公告)号：US11545753B2
公开(公告)日：2023-01-03
申请号：US17543195
申请日：2021-12-06
Applicant: ROGERS CORPORATION
Inventor： Stephen O'Connor , Gianni Taraschi , Christopher Brown , Kristi Pance , Karl E. Sprentall , Bruce Fitts , Dirk Baars , William Blasius , Murali Sethumadhavan , Roshin Rose George , Michael S. White , Michael Lunt , Sam Henson , John Dobrick
Abstract: An electromagnetic, EM, device, includes: a substrate having a dielectric layer and a first conductive layer at a first side of the substrate, the substrate having a via that extends at least partially through the substrate from the first side toward an opposing second side of the substrate; at least one dielectric structure having at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having a first average dielectric constant, the at least one dielectric structure further having a second dielectric portion that is contiguous with the first dielectric portion; wherein the second dielectric portion extends into the via of the substrate, the via having a mechanical interlock surface; and wherein the at least one dielectric structure includes a mechanical interlock between the second dielectric portion and the mechanical interlock surface of the via of the substrate.
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4.发明申请公开(公告)号：US20190341696A1
公开(公告)日：2019-11-07
申请号：US16396943
申请日：2019-04-29
Applicant: ROGERS CORPORATION
Inventor： Stephen O'Connor , Gianni Taraschi , Christopher Brown , Kristi Pance , Karl E. Sprentall , Bruce Fitts , Dirk Baars , William Blasius , Murali Sethumadhavan , Roshin Rose George , Michael S. White , Michael Lunt , Sam Henson , John Dobrick
Abstract: In an embodiment, an electromagnetic device, comprises a substrate a substrate comprising a dielectric layer and a first conductive layer; at least one dielectric structure comprising at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having an average dielectric constant and an optional second dielectric portion that extends into an optional via. The at least one dielectric structure is bonded to the substrate by at least one of: a mechanical interlock between the second dielectric portion and the substrate due to the at least one interlocking slot comprising a retrograde surface; an intermediate layer located in between the dielectric structure and the substrate having a roughened surface; or an adhesive material located in between the dielectric structure and the substrate. A method of making the device can comprise injection molding a dielectric composition onto the substrate to form the dielectric substrate.
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