Invention Grant
- Patent Title: Semiconductor device having a resin layer sealing a plurality of semiconductor chips stacked on first semiconductor chips
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Application No.: US17010926Application Date: 2020-09-03
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Publication No.: US11551985B2Publication Date: 2023-01-10
- Inventor: Yuki Sugo , Ayana Amano , Keiichiro Hattori , Takeshi Watanabe
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2020-039951 20200309
- Main IPC: H01L23/14
- IPC: H01L23/14 ; H01L25/065 ; H01L23/31 ; H01L23/495
Abstract:
A semiconductor device of an embodiment includes: a wiring board; a semiconductor chip mounted on the wiring board; and a resin-containing layer bonded on the wiring board so as to fix the semiconductor chip to the wiring board. The resin-containing layer contains a resin-containing material having a breaking strength of 15 MPa or more at 125° C.
Public/Granted literature
- US20210280480A1 SEMICONDUCTOR DEVICE Public/Granted day:2021-09-09
Information query
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