公开(公告)号：US11551985B2

公开(公告)日：2023-01-10

申请号：US17010926

申请日：2020-09-03

Applicant: Kioxia Corporation

Inventor： Yuki Sugo ,  Ayana Amano ,  Keiichiro Hattori ,  Takeshi Watanabe

IPC: H01L23/14 ,  H01L25/065 ,  H01L23/31 ,  H01L23/495

Abstract: A semiconductor device of an embodiment includes: a wiring board; a semiconductor chip mounted on the wiring board; and a resin-containing layer bonded on the wiring board so as to fix the semiconductor chip to the wiring board. The resin-containing layer contains a resin-containing material having a breaking strength of 15 MPa or more at 125° C.