Invention Grant
- Patent Title: Semiconductor laser module
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Application No.: US16437465Application Date: 2019-06-11
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Publication No.: US11552455B2Publication Date: 2023-01-10
- Inventor: Maiko Ariga , Yusuke Inaba , Kazuki Yamaoka
- Applicant: FURUKAWA ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2016-250075 20161222
- Main IPC: H01S5/50
- IPC: H01S5/50 ; H01S5/0683 ; G02B27/09 ; G02B27/10 ; G02B27/30 ; H01S5/00 ; H01S5/026

Abstract:
A disclosed semiconductor laser module includes a semiconductor laser device; a semiconductor optical amplifier configured to receive laser light emitted from the semiconductor laser device and amplify the laser light that has been received; and a first light receiving device that measures an intensity of a part of the laser light emitted from the semiconductor laser device, for monitoring a wavelength of the laser light, wherein the semiconductor optical amplifier is located rearward in relation to a light receiving surface of the first light receiving device along a propagation direction of the laser light emitted from the semiconductor device.
Public/Granted literature
- US20190296524A1 SEMICONDUCTOR LASER MODULE Public/Granted day:2019-09-26
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