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公开(公告)号：US11552455B2
公开(公告)日：2023-01-10
申请号：US16437465
申请日：2019-06-11
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Maiko Ariga , Yusuke Inaba , Kazuki Yamaoka
Abstract: A disclosed semiconductor laser module includes a semiconductor laser device; a semiconductor optical amplifier configured to receive laser light emitted from the semiconductor laser device and amplify the laser light that has been received; and a first light receiving device that measures an intensity of a part of the laser light emitted from the semiconductor laser device, for monitoring a wavelength of the laser light, wherein the semiconductor optical amplifier is located rearward in relation to a light receiving surface of the first light receiving device along a propagation direction of the laser light emitted from the semiconductor device.
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2.发明申请公开(公告)号：US20170339793A1
公开(公告)日：2017-11-23
申请号：US15669126
申请日：2017-08-04
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Etsuji Katayama , Jun Miyokawa , Maiko Ariga , Toshio Sugaya
CPC classification number: H05K1/189 , H05K1/0271 , H05K1/028 , H05K1/11 , H05K1/117 , H05K1/181 , H05K3/32 , H05K3/3447 , H05K3/363 , H05K3/366 , H05K3/40 , H05K3/4015 , H05K2201/053 , H05K2201/09618 , H05K2201/10121 , H05K2201/10303
Abstract: A flexible substrate has an insulating base member and a conductive layer that is formed on the base member and includes an electrical connecting portion fixed to a component and electrically connected to the component, and the flexible substrate includes: a main portion on which the electrical connecting portion is formed; and a protruding portion provided so as to protrude from a portion of the main portion in which the electrical connecting portion is formed, wherein the main portion is bent along a first bending line extending in a first direction, and wherein the protruding portion can be bent along a second bending line extending in a second direction intersecting the first direction and is adapted to reduce stress occurring at the electrical connecting portion by the protruding portion being bent along the second bending line.
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公开(公告)号：US11367993B2
公开(公告)日：2022-06-21
申请号：US16985289
申请日：2020-08-05
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Yusuke Inaba , Maiko Ariga , Kazuki Yamaoka
IPC: H01S5/00 , H01S5/02251 , H01S5/02216 , H01S5/0683
Abstract: A lid portion, that is mounted on a package that houses an optical isolator at a certain position, includes: a main body portion that is in contact with an upper end portion of a sidewall of the package; and a thick portion that is provided on a lower surface of the main body portion and determines a position of the lid portion with respect to the package. Further, the thick portion is provided on the lower surface other than a lower surface region of the main body portion, the lower surface region being directly above the optical isolator housed in the package when the lid portion is mounted on the package.
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公开(公告)号：US09466942B2
公开(公告)日：2016-10-11
申请号：US14564270
申请日：2014-12-09
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Tetsuya Matsuyama , Maiko Ariga , Toshio Sugaya , Toshio Kimura
IPC: H01S3/04 , H01S5/024 , H01S5/12 , H01S5/022 , H01S5/0683 , H01S5/0687 , H01S5/00 , H01S5/026
CPC classification number: H01S5/02415 , H01S5/0064 , H01S5/02208 , H01S5/0222 , H01S5/02248 , H01S5/02268 , H01S5/02284 , H01S5/02438 , H01S5/02446 , H01S5/026 , H01S5/0265 , H01S5/0683 , H01S5/0687 , H01S5/12
Abstract: An optical element module includes a casing having a bottom plate, a temperature-adjusting unit being mounted on the bottom plate in the casing and having at least a lower layer portion and an upper layer portion positioned above the lower layer portion, a support member mounted on the temperature-adjusting unit in the casing, and a semiconductor laser element being mounted on the support member and outputting a laser light to a forward side. The upper layer portion of the temperature-adjusting unit projects at a backward side of the semiconductor laser element relative to the lower layer portion.
Abstract translation: 光学元件模块包括具有底板的壳体，温度调节单元安装在壳体中的底板上，并且至少具有下层部分和位于下层部分上方的上层部分， 在壳体中的温度调节单元上，并且半导体激光元件安装在支撑构件上并向前侧输出激光。 温度调节单元的上层部分相对于下层部分在半导体激光元件的后侧突出。
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公开(公告)号：US12191627B2
公开(公告)日：2025-01-07
申请号：US17397020
申请日：2021-08-09
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Kazuki Yamaoka , Maiko Ariga , Yusuke Inaba
IPC: H01S5/0239 , H01S5/02218 , H01S5/02253
Abstract: An optical module includes: an optical functional element outputting a first light beam; a first optical part receiving the first light beam, having a predetermined effect on the first light beam, and outputting the affected first light beam as a second light beam; a second optical part receiving the second light beam, having a predetermined effect on the second light beam, outputting the affected second light beam as a third light beam, and reflecting a reflected light beam in a direction not coupled to the first optical part, the reflected light beam being generated from the second light on an incident surface on which the second light beam is incident; a housing accommodating the optical functional element, the first optical part, and the second optical part; and an optical attenuator provided inside the housing and attenuating power of the reflected light beam incident on the optical attenuator.
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Patent Agency Ranking
公开(公告)号：US11903125B2
公开(公告)日：2024-02-13
申请号：US17478030
申请日：2021-09-17
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Maiko Ariga , Yusuke Inaba , Kazuki Yamaoka , Atsushi Izawa , Kazuya Nagashima
IPC: H05K1/02 , H01S5/02218
CPC classification number: H05K1/028 , H01S5/02218 , H05K1/0274 , H05K2201/10121
Abstract: An optical module includes a box-shaped housing with an optical element mounted therein. Further, a wiring substrate is bonded to a part of a surface of a housing part of the housing, and an electric wiring, which is formed in the wiring substrate or on a surface of the wiring substrate, and an electric wiring, which is introduced into the housing part or onto a surface of the housing part, are electrically connected to each other.
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公开(公告)号：US10558063B2
公开(公告)日：2020-02-11
申请号：US15223594
申请日：2016-07-29
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Toshio Sugaya , Maiko Ariga
Abstract: An optical module includes an optical element configured to be driven at a high frequency, a circuit board arranged at a height different from a height of the optical element, and a wiring sub-mount including a wiring electrically connecting the optical element and the circuit board, the wiring being such that a height of a connection surface of one end portion of the wiring and a height of a connection surface of another end portion of the wiring are different from each other.
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公开(公告)号：US11677210B2
公开(公告)日：2023-06-13
申请号：US16985277
申请日：2020-08-05
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Yusuke Inaba , Maiko Ariga , Kazuki Yamaoka
IPC: H01S5/02251 , H01S5/02253 , H01S5/02326
CPC classification number: H01S5/02251 , H01S5/02253 , H01S5/02326
Abstract: A semiconductor laser module that includes a package accommodating therein a plurality of optical components, includes: a semiconductor laser device that emits laser light toward one end side in the package; an optical fiber having an incident end of the laser light on another end side in the package, the another end being in an opposite direction of an emission direction in which the semiconductor laser device emits the laser light; and a turn-back unit that turns back the laser light toward the another end side in the package, the another end being in the opposite direction of the emission direction in which the semiconductor laser device emits the laser light, and outputs the laser light to the incident end of the optical fiber.
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公开(公告)号：US11545814B2
公开(公告)日：2023-01-03
申请号：US16444778
申请日：2019-06-18
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Maiko Ariga , Yusuke Inaba , Kazuki Yamaoka , Toshio Sugaya
Abstract: A disclosed semiconductor laser module includes a semiconductor laser device; a waveguide optical function device that has an incidence end on which laser light emitted from the semiconductor laser device is incident and that guides the incident light; and a protrusion that is provided on an extension line of a light path of the laser light emitted from the semiconductor laser device, the extension line extending beyond the incidence end.
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公开(公告)号：US11283234B2
公开(公告)日：2022-03-22
申请号：US16986391
申请日：2020-08-06
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Kazuki Yamaoka , Maiko Ariga , Yusuke Inaba
IPC: H01S5/022 , H01S5/02208 , G02B6/42 , H01S5/00 , H01S5/40 , H01S5/02234
Abstract: An optical module includes: an optical component; a light receiving element receiving a laser beam through the optical component; a package housing the optical component and the light receiving unit; and a shielding portion that prevents stray light, which is generated by at least one of the laser beam and the laser beam emitted through the optical component is reflected or scattered in the package or at the optical component, from being incident on the light receiving element.
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