公开(公告)号：US12066657B2

公开(公告)日：2024-08-20

申请号：US17393957

申请日：2021-08-04

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Yusuke Inaba ,  Junichi Hasegawa ,  Maiko Ariga ,  Kazuki Yamaoka

IPC: G02B6/12 ,  G02B6/293 ,  G02B6/42 ,  H01S5/0239

CPC classification number: G02B6/12007 ,  G02B6/1203 ,  G02B6/29398 ,  G02B6/4228 ,  G02B6/4244 ,  G02B6/426 ,  H01S5/0239 ,  G02B6/29338 ,  G02B6/29352 ,  G02B6/4286

Abstract: An optical module includes: a substrate and a waveguide element having a mount face opposed to the substrate, the waveguide element having an interference waveguide portion having an optical interference function. Further, the mount face includes a projection region to which the interference waveguide portion is projected on the mount face and a non-projection region, and the waveguide element is joined to the substrate with a joint material in the non-projection region.

公开(公告)号：US10811840B2

公开(公告)日：2020-10-20

申请号：US16053850

申请日：2018-08-03

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Maiko Ariga ,  Yusuke Inaba ,  Kazuaki Kiyota ,  Toshihito Suzuki

IPC: H01S5/026 ,  H01S5/022 ,  H01S5/10 ,  H01S5/02 ,  H01S5/024 ,  H01S5/125 ,  H01S5/14 ,  H01S5/028 ,  H01S5/00 ,  H01S5/50 ,  H01S5/0687

Abstract: A laser module that can suppress influence due to a reflected light between chips is provided. A laser module 100 according to one embodiment of the present invention includes: a laser element 110 provided on a first substrate and having a laser oscillation unit that generates a laser light and a first optical waveguide that guides the laser light; and an optical amplifier 120 provided on a second substrate and having a second waveguide that guides the laser light. The first optical waveguide is nonparallel relative to an end face of the first substrate and connected thereto, the second optical waveguide is nonparallel relative to an end face of the second substrate and connected thereto, and the first substrate and the second substrate are arranged such that the laser light output from the first optical waveguide is optically coupled to the second optical waveguide.

公开(公告)号：US11552455B2

公开(公告)日：2023-01-10

申请号：US16437465

申请日：2019-06-11

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Maiko Ariga ,  Yusuke Inaba ,  Kazuki Yamaoka

IPC: H01S5/50 ,  H01S5/0683 ,  G02B27/09 ,  G02B27/10 ,  G02B27/30 ,  H01S5/00 ,  H01S5/026

Abstract: A disclosed semiconductor laser module includes a semiconductor laser device; a semiconductor optical amplifier configured to receive laser light emitted from the semiconductor laser device and amplify the laser light that has been received; and a first light receiving device that measures an intensity of a part of the laser light emitted from the semiconductor laser device, for monitoring a wavelength of the laser light, wherein the semiconductor optical amplifier is located rearward in relation to a light receiving surface of the first light receiving device along a propagation direction of the laser light emitted from the semiconductor device.

公开(公告)号：US11367993B2

公开(公告)日：2022-06-21

申请号：US16985289

申请日：2020-08-05

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Yusuke Inaba ,  Maiko Ariga ,  Kazuki Yamaoka

IPC: H01S5/00 ,  H01S5/02251 ,  H01S5/02216 ,  H01S5/0683

Abstract: A lid portion, that is mounted on a package that houses an optical isolator at a certain position, includes: a main body portion that is in contact with an upper end portion of a sidewall of the package; and a thick portion that is provided on a lower surface of the main body portion and determines a position of the lid portion with respect to the package. Further, the thick portion is provided on the lower surface other than a lower surface region of the main body portion, the lower surface region being directly above the optical isolator housed in the package when the lid portion is mounted on the package.

公开(公告)号：US12191627B2

公开(公告)日：2025-01-07

申请号：US17397020

申请日：2021-08-09

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Kazuki Yamaoka ,  Maiko Ariga ,  Yusuke Inaba

IPC: H01S5/0239 ,  H01S5/02218 ,  H01S5/02253

Abstract: An optical module includes: an optical functional element outputting a first light beam; a first optical part receiving the first light beam, having a predetermined effect on the first light beam, and outputting the affected first light beam as a second light beam; a second optical part receiving the second light beam, having a predetermined effect on the second light beam, outputting the affected second light beam as a third light beam, and reflecting a reflected light beam in a direction not coupled to the first optical part, the reflected light beam being generated from the second light on an incident surface on which the second light beam is incident; a housing accommodating the optical functional element, the first optical part, and the second optical part; and an optical attenuator provided inside the housing and attenuating power of the reflected light beam incident on the optical attenuator.

公开(公告)号：US11903125B2

公开(公告)日：2024-02-13

申请号：US17478030

申请日：2021-09-17

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Maiko Ariga ,  Yusuke Inaba ,  Kazuki Yamaoka ,  Atsushi Izawa ,  Kazuya Nagashima

IPC: H05K1/02 ,  H01S5/02218

CPC classification number: H05K1/028 ,  H01S5/02218 ,  H05K1/0274 ,  H05K2201/10121

Abstract: An optical module includes a box-shaped housing with an optical element mounted therein. Further, a wiring substrate is bonded to a part of a surface of a housing part of the housing, and an electric wiring, which is formed in the wiring substrate or on a surface of the wiring substrate, and an electric wiring, which is introduced into the housing part or onto a surface of the housing part, are electrically connected to each other.

公开(公告)号：US11677210B2

公开(公告)日：2023-06-13

申请号：US16985277

申请日：2020-08-05

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Yusuke Inaba ,  Maiko Ariga ,  Kazuki Yamaoka

IPC: H01S5/02251 ,  H01S5/02253 ,  H01S5/02326

CPC classification number: H01S5/02251 ,  H01S5/02253 ,  H01S5/02326

Abstract: A semiconductor laser module that includes a package accommodating therein a plurality of optical components, includes: a semiconductor laser device that emits laser light toward one end side in the package; an optical fiber having an incident end of the laser light on another end side in the package, the another end being in an opposite direction of an emission direction in which the semiconductor laser device emits the laser light; and a turn-back unit that turns back the laser light toward the another end side in the package, the another end being in the opposite direction of the emission direction in which the semiconductor laser device emits the laser light, and outputs the laser light to the incident end of the optical fiber.

公开(公告)号：US11545814B2

公开(公告)日：2023-01-03

申请号：US16444778

申请日：2019-06-18

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Maiko Ariga ,  Yusuke Inaba ,  Kazuki Yamaoka ,  Toshio Sugaya

IPC: H01S5/50 ,  H01S5/10 ,  H01S5/40 ,  G02B6/42 ,  H01S5/022 ,  H01S5/02326 ,  H01S5/00

Abstract: A disclosed semiconductor laser module includes a semiconductor laser device; a waveguide optical function device that has an incidence end on which laser light emitted from the semiconductor laser device is incident and that guides the incident light; and a protrusion that is provided on an extension line of a light path of the laser light emitted from the semiconductor laser device, the extension line extending beyond the incidence end.

公开(公告)号：US11283234B2

公开(公告)日：2022-03-22

申请号：US16986391

申请日：2020-08-06

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Kazuki Yamaoka ,  Maiko Ariga ,  Yusuke Inaba

IPC: H01S5/022 ,  H01S5/02208 ,  G02B6/42 ,  H01S5/00 ,  H01S5/40 ,  H01S5/02234

Abstract: An optical module includes: an optical component; a light receiving element receiving a laser beam through the optical component; a package housing the optical component and the light receiving unit; and a shielding portion that prevents stray light, which is generated by at least one of the laser beam and the laser beam emitted through the optical component is reflected or scattered in the package or at the optical component, from being incident on the light receiving element.

公开(公告)号：US20190312414A1

公开(公告)日：2019-10-10

申请号：US16444778

申请日：2019-06-18

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Maiko Ariga ,  Yusuke Inaba ,  Kazuki Yamaoka ,  Toshio Sugaya

IPC: H01S5/50 ,  H01S5/022 ,  H01S5/10

Abstract: A disclosed semiconductor laser module includes a semiconductor laser device; a waveguide optical function device that has an incidence end on which laser light emitted from the semiconductor laser device is incident and that guides the incident light; and a protrusion that is provided on an extension line of a light path of the laser light emitted from the semiconductor laser device, the extension line extending beyond the incidence end.