Invention Grant
- Patent Title: Coating film forming method
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Application No.: US16735902Application Date: 2020-01-07
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Publication No.: US11557495B2Publication Date: 2023-01-17
- Inventor: Shogo Inaba
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Posz Law Group, PLC
- Priority: JPJP2019-007290 20190118
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B05C11/08 ; H01L21/02 ; G03F7/16 ; B05D1/00

Abstract:
A coating film forming method includes: rotating a substrate at a first rotation speed in a coating cup with an upper surface open, and supplying and diffusing a coating solution for forming a coating film on the substrate; and after the supplying and diffusing the coating solution, drying the substrate by exhausting air through a gap between an annular member arranged above the substrate with centers thereof being located on a same axis and the front surface of the substrate, while rotating the substrate at a second rotation speed lower than the first rotation speed, wherein at the drying the substrate, a flow velocity of the air exhausted through the gap is higher than a flow velocity of air supplied from above the substrate in the coating cup to the substrate.
Public/Granted literature
- US20200234979A1 COATING FILM FORMING METHOD AND COATING FILM FORMING APPARATUS Public/Granted day:2020-07-23
Information query
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