- Patent Title: Sinter sheet, semiconductor device and manufacturing method thereof
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Application No.: US16902584Application Date: 2020-06-16
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Publication No.: US11557563B2Publication Date: 2023-01-17
- Inventor: Tomohito Iwashige , Katsuya Kumagai , Takeshi Endoh
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JPJP2019-114680 20190620
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A sintered member is provided between a semiconductor chip and a terminal. The sintered member is made of a sinter sheet by heating and pressing the same. The semiconductor chip is connected to the terminal via the sintered member. Convex portions are formed at a front-side surface of the semiconductor chip. Concave portions, each of which has such a shape corresponding to that of each convex portion of the semiconductor chip, are formed at a surface of the sintered member facing to the semiconductor chip.
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