公开(公告)号：US11557563B2

公开(公告)日：2023-01-17

申请号：US16902584

申请日：2020-06-16

Applicant: DENSO CORPORATION

Inventor： Tomohito Iwashige ,  Katsuya Kumagai ,  Takeshi Endoh

IPC: H01L23/00

Abstract: A sintered member is provided between a semiconductor chip and a terminal. The sintered member is made of a sinter sheet by heating and pressing the same. The semiconductor chip is connected to the terminal via the sintered member. Convex portions are formed at a front-side surface of the semiconductor chip. Concave portions, each of which has such a shape corresponding to that of each convex portion of the semiconductor chip, are formed at a surface of the sintered member facing to the semiconductor chip.