公开(公告)号：US11557563B2

公开(公告)日：2023-01-17

申请号：US16902584

申请日：2020-06-16

Applicant: DENSO CORPORATION

Inventor： Tomohito Iwashige ,  Katsuya Kumagai ,  Takeshi Endoh

IPC: H01L23/00

Abstract: A sintered member is provided between a semiconductor chip and a terminal. The sintered member is made of a sinter sheet by heating and pressing the same. The semiconductor chip is connected to the terminal via the sintered member. Convex portions are formed at a front-side surface of the semiconductor chip. Concave portions, each of which has such a shape corresponding to that of each convex portion of the semiconductor chip, are formed at a surface of the sintered member facing to the semiconductor chip.

公开(公告)号：US12278170B2

公开(公告)日：2025-04-15

申请号：US17846371

申请日：2022-06-22

Applicant: DENSO CORPORATION ,  TOYOTA JIDOSHA KABUSHIKI KAISHA ,  MIRISE Technologies Corporation

Inventor： Hiroshi Ishino ,  Hirokazu Sampei ,  Katsuya Kumagai ,  Koji Doi

IPC: H01L23/495 ,  H01L23/31

Abstract: A semiconductor module includes a resin molded part encapsulating a semiconductor chip, a first terminal having a plate shape, and a second terminal having a plate shape. The first terminal and the second terminal are disposed on top of the other in a thickness direction. The first terminal is exposed from a first surface of the resin molded part, and the second terminal is projected from a second surface of the resin molded part to an outside of the resin molded part, the second surface being different from the first surface from which the first terminal is exposed.