Invention Grant
- Patent Title: Brazed joint and semiconductor processing chamber component having the same
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Application No.: US16249731Application Date: 2019-01-16
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Publication No.: US11560913B2Publication Date: 2023-01-24
- Inventor: Govinda Raj , Tom K. Cho , Hamid Mohiuddin , Ian Widlow
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: B23K1/00
- IPC: B23K1/00 ; F16B5/08 ; B23K1/20 ; C04B37/02 ; B23K101/40 ; B23K103/00 ; B23K103/16

Abstract:
Methods of forming a metallic-ceramic brazed joint are disclosed herein. The method of forming the brazed joint includes deoxidizing the surface of metallic components, assembling the joint, heating the joint to fuse the joint components, and cooling the joint. In certain embodiments, the brazed joint includes a conformal layer. In further embodiments, the brazed joint has features in order to reduce stress concentrations within the joint.
Public/Granted literature
- US20190226512A1 BRAZED JOINT AND SEMICONDUCTOR PROCESSING CHAMBER COMPONENT HAVING THE SAME Public/Granted day:2019-07-25
Information query
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