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公开(公告)号:US10005025B2
公开(公告)日:2018-06-26
申请号:US14877753
申请日:2015-10-07
CPC分类号: B01D53/32 , B01D53/68 , B01D2257/2025 , B01D2257/2027 , B01D2257/2045 , B01D2257/2047 , B01D2258/0216 , B01D2259/818 , H01J37/32082 , H01J37/321 , H01J37/3244 , H01J37/32477 , H01J37/32844 , Y02C20/30
摘要: Embodiments disclosed herein include a plasma source, and an abatement system for abating compounds produced in semiconductor processes. In one embodiment, a plasma source is disclosed. The plasma source includes a body having an inlet and an outlet, and the inlet and the outlet are fluidly coupled within the body. The body further includes inside surfaces, and the inside surfaces are coated with yttrium oxide or diamond-like carbon. The plasma source further includes a flow splitter disposed in the body in a position that formed two flow paths between the inlet and the outlet, and a plasma generator disposed in a position operable to form a plasma within the body between the flow splitter and inside surfaces of the body.
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公开(公告)号:US11560913B2
公开(公告)日:2023-01-24
申请号:US16249731
申请日:2019-01-16
发明人: Govinda Raj , Tom K. Cho , Hamid Mohiuddin , Ian Widlow
IPC分类号: B23K1/00 , F16B5/08 , B23K1/20 , C04B37/02 , B23K101/40 , B23K103/00 , B23K103/16
摘要: Methods of forming a metallic-ceramic brazed joint are disclosed herein. The method of forming the brazed joint includes deoxidizing the surface of metallic components, assembling the joint, heating the joint to fuse the joint components, and cooling the joint. In certain embodiments, the brazed joint includes a conformal layer. In further embodiments, the brazed joint has features in order to reduce stress concentrations within the joint.
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