Invention Grant
- Patent Title: Method of detecting a possible thinning of a substrate of an integrated circuit via the rear face thereof, and associated device
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Application No.: US16800448Application Date: 2020-02-25
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Publication No.: US11562933B2Publication Date: 2023-01-24
- Inventor: Alexandre Sarafianos , Abderrezak Marzaki
- Applicant: STMicroelectronics (Rousset) SAS
- Applicant Address: FR Rousset
- Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee Address: FR Rousset
- Agency: Crowe & Dunlevy
- Priority: FR1761625 20171205
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L23/00 ; H03K19/00 ; H01L29/00

Abstract:
A semiconductor substrate includes a buried semiconductor layer and semiconductor wells. A device for detecting a possible thinning of the semiconductor substrate via the rear face thereof is formed on and in the semiconductor wells. The device is a non-inverting buffer including an input terminal and an output terminal, the device being powered between a supply terminal and a reference terminal where the buried semiconductor layer provides the supply terminal. A control circuit delivers an input signal in a first state to the input terminal and outputs a control signal indicating a detection of a thinning of the substrate if a signal generated at the output terminal in response to the input signal is in a second state different from the first state.
Information query
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