Invention Grant
- Patent Title: Method for manufacturing a semiconductor device
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Application No.: US17471244Application Date: 2021-09-10
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Publication No.: US11563089B2Publication Date: 2023-01-24
- Inventor: Seojin Jeong , Jinyeong Joe , Seokhoon Kim , Jeongho Yoo , Seung Hun Lee , Sihyung Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR10-2019-0067504 20190607
- Main IPC: H01L21/82
- IPC: H01L21/82 ; H01L21/76 ; H01L29/16 ; H01L29/10 ; H01L29/04 ; H01L29/167 ; H01L29/36 ; H01L27/092 ; H01L29/06 ; H01L21/8238 ; H01L21/762 ; H01L29/66 ; H01L29/08 ; H01L21/02

Abstract:
A semiconductor device includes a substrate, a device isolation layer on the substrate, the device isolation layer defining a first active pattern, a pair of first source/drain patterns on the first active pattern, the pair of first source/drain patterns being spaced apart from each other in a first direction, and each of the pair of first source/drain patterns having a maximum first width in the first direction, a first channel pattern between the pair of first source/drain patterns, a gate electrode on the first channel pattern and extends in a second direction intersecting the first direction, and a first amorphous region in the first active pattern, the first amorphous region being below at least one of the pair of first source/drain patterns, and having a maximum second width in the first direction that is less than the maximum first width.
Public/Granted literature
- US20210408241A1 METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE Public/Granted day:2021-12-30
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